AM29LV128MH123REI Spansion Inc., AM29LV128MH123REI Datasheet - Page 5

• Manufacturer Part Number: AM29LV128MH123REI
• Manufacturer: Spansion Inc.

Specifications of AM29LV128MH123REI

• Cell Type: NOR
• Density: 128Mb
• Access Time (max): 120ns
• Interface Type: Parallel
• Boot Type: Not Required
• Address Bus: 24/23Bit
• Operating Supply Voltage (typ): 3.3V
• Operating Temp Range: -40C to 85C
• Package Type: TSOP
• Program/erase Volt (typ): 3/11.5 to 12.5V
• Sync/async: Asynchronous
• Operating Temperature Classification: Industrial
• Operating Supply Voltage (min): 3V
• Operating Supply Voltage (max): 3.6V
• Word Size: 8/16Bit
• Number Of Words: 16M/8M
• Supply Current: 43mA
• Mounting: Surface Mount
• Pin Count: 56
• Lead Free Status / Rohs Status: Not Compliant

TABLE OF CONTENTS
Product Selector Guide . . . . . . . . . . . . . . . . . . . . . 6
Block Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
Connection Diagrams . . . . . . . . . . . . . . . . . . . . . . 7
Pin Description. . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
Logic Symbol . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
Ordering Information . . . . . . . . . . . . . . . . . . . . . . 10
Device Bus Operations . . . . . . . . . . . . . . . . . . . . 11
Common Flash Memory Interface (CFI) . . . . . . . 25
Command Definitions . . . . . . . . . . . . . . . . . . . . . 29
January 31, 2007 25270C7
Continuity of Specifications ............................................................. i
For More Information ....................................................................... i
Word/Byte Configuration ........................................................ 11
VersatileIO™ (V
Requirements for Reading Array Data ......................................... 12
Page Mode Read .................................................................... 12
Writing Commands/Command Sequences .................................. 12
Write Buffer ............................................................................. 12
Accelerated Program Operation ............................................. 12
Autoselect Functions .............................................................. 12
Standby Mode ........................................................................ 12
Automatic Sleep Mode ................................................................. 13
RESET#: Hardware Reset Pin ..................................................... 13
Output Disable Mode ................................................................... 13
Autoselect Mode..................................................................... 20
Sector Group Protection and Unprotection .................................. 21
Write Protect (WP#)................................................................ 22
Temporary Sector Group Unprotect ............................................. 22
Secured Silicon Sector Flash Memory Region ............................. 24
Hardware Data Protection ............................................................ 25
Low VCC Write Inhibit ............................................................ 25
Write Pulse “Glitch” Protection ............................................... 25
Logical Inhibit .......................................................................... 25
Power-Up Write Inhibit ............................................................ 25
Reading Array Data ...................................................................... 29
Reset Command .......................................................................... 29
Autoselect Command Sequence .................................................. 29
Enter Secured Silicon Sector/Exit Secured Silicon Sector
Command Sequence ................................................................... 30
Word Program Command Sequence ........................................... 30
Unlock Bypass Command Sequence ..................................... 30
Write Buffer Programming ...................................................... 30
Accelerated Program .............................................................. 31
Program Suspend/Program Resume Command Sequence ........ 33
Chip Erase Command Sequence ................................................. 34
Table 1. Device Bus Operations ...........................................................11
Table 2. Sector Address Table ..............................................................14
Table 3. Autoselect Codes, (High Voltage Method) .............................20
Table 4. Sector Group Protection/Unprotection Address Table .....21
Figure 1. Temporary Sector Group Unprotect Operation................ 22
Figure 2. In-System Sector Group Protect/Unprotect Algorithms ... 23
Table 5. Secured Silicon Sector Contents ......................................24
Figure 3. Secured Silicon Sector Protect Verify .............................. 25
Table 6. CFI Query Identification String .............................. 26
Table 7. System Interface String......................................................26
Table 8. Device Geometry Definition................................... 27
Table 9. Primary Vendor-Specific Extended Query............. 28
Figure 4. Write Buffer Programming Operation............................... 32
Figure 5. Program Operation .......................................................... 33
Figure 6. Program Suspend/Program Resume............................... 34
IO
) Control ........................................................... 11
D A T A
Am29LV128MH/L
S H E E T
Write Operation Status . . . . . . . . . . . . . . . . . . . . . 39
Absolute Maximum Ratings. . . . . . . . . . . . . . . . . 44
Operating Ranges . . . . . . . . . . . . . . . . . . . . . . . . . 44
DC Characteristics . . . . . . . . . . . . . . . . . . . . . . . . 45
Test Conditions. . . . . . . . . . . . . . . . . . . . . . . . . . . 46
Key to Switching Waveforms. . . . . . . . . . . . . . . . 46
AC Characteristics . . . . . . . . . . . . . . . . . . . . . . . . 47
Latchup Characteristics . . . . . . . . . . . . . . . . . . . . 59
Erase And Programming Performance. . . . . . . . 60
TSOP Pin and BGA Package Capacitance . . . . . 61
Data Retention. . . . . . . . . . . . . . . . . . . . . . . . . . . . 61
Physical Dimensions . . . . . . . . . . . . . . . . . . . . . . 62
Revision Summary . . . . . . . . . . . . . . . . . . . . . . . . 64
Sector Erase Command Sequence .............................................. 34
Erase Suspend/Erase Resume Commands ................................ 35
Command Definitions ............................................................. 37
DQ7: Data# Polling ...................................................................... 39
RY/BY#: Ready/Busy#............................................................ 40
DQ6: Toggle Bit I .......................................................................... 40
DQ2: Toggle Bit II ......................................................................... 41
Reading Toggle Bits DQ6/DQ2 .................................................... 41
DQ5: Exceeded Timing Limits ...................................................... 42
DQ3: Sector Erase Timer ............................................................. 42
DQ1: Write-to-Buffer Abort ........................................................... 42
Read-Only Operations ........................................................... 47
Hardware Reset (RESET#) .................................................... 49
Erase and Program Operations .............................................. 50
Temporary Sector Group Unprotect ....................................... 56
Alternate CE# Controlled Erase and Program Operations ..... 58
TS056/TSR056—56-Pin Standard/Reverse Thin Small Outline
Package (TSOP) ..................................................................... 62
LAA064—64-Ball Fortified Ball Grid Array
13 x 11 mm Package .............................................................. 63
Figure 7. Erase Operation.............................................................. 36
Table 10. Command Definitions (x16 Mode, BYTE# = V
Table 11. Command Definitions (x8 Mode, BYTE# = V
Figure 8. Data# Polling Algorithm .................................................. 39
Figure 9. Toggle Bit Algorithm........................................................ 41
Table 12. Write Operation Status ......................................................... 43
Figure 10. Maximum Negative Overshoot Waveform ................... 44
Figure 11. Maximum Positive Overshoot Waveform..................... 44
Figure 12. Test Setup.................................................................... 46
Table 13. Test Specifications ......................................................... 46
Figure 13. Input Waveforms and Measurement Levels ................. 46
Figure 14. Read Operation Timings ............................................... 47
Figure 15. Page Read Timings ...................................................... 48
Figure 16. Reset Timings ............................................................... 49
Figure 17. Reset Timings ............................................................... 51
Figure 18. Program Operation Timings.......................................... 52
Figure 19. Accelerated Program Timing Diagram.......................... 52
Figure 20. Chip/Sector Erase Operation Timings .......................... 53
Figure 21. Data# Polling Timings (During Embedded Algorithms). 54
Figure 22. Toggle Bit Timings (During Embedded Algorithms)...... 55
Figure 23. DQ2 vs. DQ6................................................................. 55
Figure 24. Temporary Sector Group Unprotect Timing Diagram ... 56
Figure 25. Sector Group Protect and Unprotect Timing Diagram .. 57
Figure 26. Alternate CE# Controlled Write (Erase/Program)
Operation Timings.......................................................................... 59
IL
IH
) ................... 38
) ................. 37
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