PCF8576CH NXP Semiconductors, PCF8576CH Datasheet - Page 2
PCF8576CH
Manufacturer Part Number
PCF8576CH
Description
Manufacturer
NXP Semiconductors
Datasheet
1.PCF8576CH.pdf
(56 pages)
Specifications of PCF8576CH
Operating Supply Voltage (typ)
2.5/3.3/5V
Number Of Digits
20
Number Of Segments
160
Package Type
LQFP
Pin Count
64
Mounting
Surface Mount
Power Dissipation
400mW
Frequency (max)
315KHz
Operating Supply Voltage (min)
2V
Operating Supply Voltage (max)
6V
Lead Free Status / Rohs Status
Compliant
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
PCF8576CH
Manufacturer:
PHILIPS
Quantity:
22 164
Company:
Part Number:
PCF8576CH/1
Manufacturer:
NXP
Quantity:
12 000
Part Number:
PCF8576CH/1
Manufacturer:
NXP/恩智浦
Quantity:
20 000
Company:
Part Number:
PCF8576CH/1,118
Manufacturer:
NXP Semiconductors
Quantity:
10 000
Company:
Part Number:
PCF8576CH/1,157
Manufacturer:
NXP Semiconductors
Quantity:
10 000
Company:
Part Number:
PCF8576CH/F1
Manufacturer:
PHI
Quantity:
10
Part Number:
PCF8576CH/F1
Manufacturer:
PHILIPS/飞利浦
Quantity:
20 000
Part Number:
PCF8576CHL
Manufacturer:
NXP/恩智浦
Quantity:
20 000
Part Number:
PCF8576CHL/1
Manufacturer:
NXP/恩智浦
Quantity:
20 000
Company:
Part Number:
PCF8576CHL/1,118
Manufacturer:
NXP Semiconductors
Quantity:
10 000
Company:
Part Number:
PCF8576CHL/1,157
Manufacturer:
NXP Semiconductors
Quantity:
10 000
Company:
Part Number:
PCF8576CHL1
Manufacturer:
NICHICON
Quantity:
5 503
NXP Semiconductors
3. Ordering information
Table 1.
[1]
[2]
4. Marking
PCF8576C_9
Product data sheet
Type number
PCF8576CH
PCF8576CT
PCF8576CTT
PCF8576CU/10 PCF8576CU/10 wire bond die; 56 bonding pads; 3.0
PCF8576CU
PCF8576CU/2
Delivery form: chip on FFC.
Delivery form: chip in tray.
Ordering information
Package
Name
LQFP64
VSO56
HTSSOP56
PCF8576CU
PCF8576CU/2
Table 2.
Type number
PCF8576CH
PCF8576CT
PCF8576CTT
PCF8576CU/10
PCF8576CU
PCF8576CU/2
Description
plastic low profile quad flat package;
64 leads; body 10
plastic very small outline package, 56 leads
plastic thermal enhanced thin shrink small outline package, 56 leads;
body width 6.1 mm; exposed die pad
wire bond die; 56 bonding pads; 3.0
bare die; 56 bumps; 3.0
Marking codes
Rev. 09 — 9 July 2009
10
1.4 mm
2.82
0.40 mm
Universal LCD driver for low multiplex rates
2.82
2.82
Marking code
PCF8576CH
PCF8576CT
PCF8576CTT
PC8576C-1
PC8576C-1
PC8576C-2
[2]
0.38 mm
0.38 mm
[1]
[2]
PCF8576C
© NXP B.V. 2009. All rights reserved.
Version
SOT314-2
SOT190-1
SOT793-1
PCF8576CU/10
PCF8576CU
PCF8576CU/2
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