PCF8576CH NXP Semiconductors, PCF8576CH Datasheet - Page 51

PCF8576CH

Manufacturer Part Number
PCF8576CH
Description
Manufacturer
NXP Semiconductors
Datasheet

Specifications of PCF8576CH

Operating Supply Voltage (typ)
2.5/3.3/5V
Number Of Digits
20
Number Of Segments
160
Package Type
LQFP
Pin Count
64
Mounting
Surface Mount
Power Dissipation
400mW
Frequency (max)
315KHz
Operating Supply Voltage (min)
2V
Operating Supply Voltage (max)
6V
Lead Free Status / Rohs Status
Compliant

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NXP Semiconductors
PCF8576C_9
Product data sheet
18.4 Reflow soldering
Key characteristics in reflow soldering are:
Table 25.
Table 26.
Moisture sensitivity precautions, as indicated on the packing, must be respected at all
times.
Studies have shown that small packages reach higher temperatures during reflow
soldering, see
Package thickness (mm)
< 2.5
Package thickness (mm)
< 1.6
1.6 to 2.5
> 2.5
2.5
Lead-free versus SnPb soldering; note that a lead-free reflow process usually leads to
higher minimum peak temperatures (see
reducing the process window
Solder paste printing issues including smearing, release, and adjusting the process
window for a mix of large and small components on one board
Reflow temperature profile; this profile includes preheat, reflow (in which the board is
heated to the peak temperature) and cooling down. It is imperative that the peak
temperature is high enough for the solder to make reliable solder joints (a solder paste
characteristic). In addition, the peak temperature must be low enough that the
packages and/or boards are not damaged. The peak temperature of the package
depends on package thickness and volume and is classified in accordance with
Table 25
SnPb eutectic process (from J-STD-020C)
Lead-free process (from J-STD-020C)
and
Figure
26
41.
Rev. 09 — 9 July 2009
Package reflow temperature ( C)
Volume (mm
< 350
235
220
Package reflow temperature ( C)
Volume (mm
< 350
260
260
250
3
3
)
)
Universal LCD driver for low multiplex rates
Figure
350 to 2000
260
250
245
41) than a SnPb process, thus
220
220
350
PCF8576C
> 2000
260
245
245
© NXP B.V. 2009. All rights reserved.
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