TEA1095TS NXP Semiconductors, TEA1095TS Datasheet - Page 22
TEA1095TS
Manufacturer Part Number
TEA1095TS
Description
Manufacturer
NXP Semiconductors
Datasheet
1.TEA1095TS.pdf
(28 pages)
Specifications of TEA1095TS
Operating Temp Range
-25C to 75C
Package Type
SSOP
Pin Count
24
Operating Temperature Classification
Commercial
Mounting
Surface Mount
Lead Free Status / Rohs Status
Compliant
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Part Number:
TEA1095TS
Manufacturer:
PHILIPS/飞利浦
Quantity:
20 000
Philips Semiconductors
1997 Nov 25
SSOP24: plastic shrink small outline package; 24 leads; body width 5.3 mm
Voice switched speakerphone IC
DIMENSIONS (mm are the original dimensions)
Note
1. Plastic or metal protrusions of 0.20 mm maximum per side are not included.
UNIT
mm
OUTLINE
VERSION
SOT340-1
max.
2.0
A
24
1
Z
0.21
0.05
A
y
pin 1 index
1
1.80
1.65
A
2
IEC
0.25
A
3
e
D
0.38
0.25
b
p
MO-150AG
0.20
0.09
JEDEC
c
REFERENCES
b
D
8.4
8.0
p
0
(1)
13
12
E
5.4
5.2
w
(1)
M
scale
EIAJ
0.65
2.5
22
e
c
H
7.9
7.6
E
A
2
5 mm
1.25
L
A
1
1.03
0.63
L
p
H
E
E
0.9
0.7
detail X
Q
L
PROJECTION
EUROPEAN
L
0.2
p
v
Q
(A )
0.13
w
3
A
Product specification
0.1
A
y
TEA1095
ISSUE DATE
X
v
93-09-08
95-02-04
Z
0.8
0.4
M
(1)
SOT340-1
A
8
0
o
o