AX500-2FG484 MICROSEMI, AX500-2FG484 Datasheet

no-image

AX500-2FG484

Manufacturer Part Number
AX500-2FG484
Description
Manufacturer
MICROSEMI
Datasheet

Specifications of AX500-2FG484

Family Name
Axcelerator
Number Of Usable Gates
286000
Number Of Logic Blocks/elements
5376
# Registers
5376
# I/os (max)
317
Frequency (max)
870MHz
Process Technology
0.15um (CMOS)
Operating Supply Voltage (typ)
1.5V
Logic Cells
5376
Ram Bits
73728
Device System Gates
500000
Propagation Delay Time
0.74ns
Operating Supply Voltage (min)
1.425V
Operating Supply Voltage (max)
1.575V
Operating Temp Range
0C to 70C
Operating Temperature Classification
Commercial
Mounting
Surface Mount
Pin Count
484
Package Type
FBGA
Lead Free Status / Rohs Status
Not Compliant

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
AX500-2FG484
Manufacturer:
Microsemi SoC
Quantity:
10 000
Part Number:
AX500-2FG484I
Manufacturer:
Microsemi SoC
Quantity:
10 000
Axcelerator Family FPGAs
Leading-Edge Performance
• 350+ MHz System Performance
• 500+ MHz Internal Performance
• High-Performance Embedded FIFOs
• 700 Mb/s LVDS Capable I/Os
Specifications
• Up to 2 Million Equivalent System Gates
• Up to 684 I/Os
• Up to 10,752 Dedicated Flip-Flops
• Up to 295 kbits Embedded SRAM/FIFO
• Manufactured on Advanced 0.15 μm CMOS Antifuse
Features
• Single-Chip, Nonvolatile Solution
• Up to 100% Resource Utilization with 100% Pin Locking
• 1.5V Core Voltage for Low Power
• Footprint Compatible Packaging
• Flexible, Multi-Standard I/Os:
Table 1-1 • Axcelerator Family Product Profile
O c t o b e r 2 0 0 9
© 2009 Actel Corporation
Device
Capacity (in Equivalent System Gates)
Modules
Embedded RAM/FIFO
Clocks (Segmentable)
PLLs
I/Os
Package
Typical Gates
Register (R-cells)
Combinatorial (C-cells)
Maximum Flip-Flops
Number of Core RAM Blocks
Total Bits of Core RAM
Hardwired
Routed
I/O Banks
Maximum User I/Os
Maximum LVDS Channels
Total I/O Registers
CSP
PQFP
BGA
FBGA
CQFP
CCGA
Process Technology, 7 Layers of Metal
– 1.5V, 1.8V, 2.5V, 3.3V Mixed Voltage Operation
– Bank-Selectable I/Os – 8 Banks per Chip
– Single-Ended I/O Standards: LVTTL, LVCMOS, 3.3V
– Differential I/O Standards: LVPECL and LVDS
PCI, and 3.3V PCI-X
256, 324
125,000
AX125
82,000
18,432
1,344
1,344
672
168
504
180
84
4
4
4
8
8
• Embedded Memory:
• Segmentable Clock Resources
• Embedded Phase-Locked Loop:
• Deterministic, User-Controllable Timing
• Unique In-System Diagnostic and Debug Capability
• Boundary-Scan Testing Compliant with IEEE Standard
• FuseLock
256, 484
208, 352
250,000
154,000
AX250
55,296
1,408
2,816
2,816
248
124
744
208
– Voltage-Referenced I/O Standards: GTL+, HSTL
– Registered I/Os
– Hot-Swap Compliant I/Os (except PCI)
– Programmable Slew Rate and Drive Strength on
– Programmable Delay and Weak Pull-Up/Pull-Down
– Variable-Aspect 4,608-bit RAM Blocks (x1, x2, x4,
– Independent, Width-Configurable Read and Write Ports
– Programmable Embedded FIFO Control Logic
– 14-200 MHz Input Range
– Frequency Synthesis Capabilities up to 1 GHz
with Actel Silicon Explorer II
1149.1 (JTAG)
Prevents Reverse Engineering and Design Theft
12
4
4
8
8
Class 1, SSTL2 Class 1 and 2, SSTL3 Class 1 and 2
Outputs
Circuits on Inputs
x9, x18, x36 Organizations Available)
TM
484, 676
208, 352
500,000
286,000
AX500
See the Actel website for the latest version of the datasheet.
73,728
2,688
5,376
5,376
1,008
336
168
Secure
208
16
4
4
8
8
Programming
484, 676, 896
1,000,000
AX1000
612,000
165,888
12,096
12,096
6,048
1,548
516
258
729
352
624
36
4
4
8
8
Technology
2,000,000
1,060,000
896, 1152
AX2000
256, 352
294,912
10,752
21,504
21,504
2,052
684
342
624
64
u
4
4
8
8
e
v 2 . 8
v 2 . 8
i

Related parts for AX500-2FG484

AX500-2FG484 Summary of contents

Page 1

... Unique In-System Diagnostic and Debug Capability with Actel Silicon Explorer II • Boundary-Scan Testing Compliant with IEEE Standard 1149.1 (JTAG) TM • FuseLock Secure Prevents Reverse Engineering and Design Theft AX125 AX250 AX500 125,000 250,000 500,000 82,000 154,000 286,000 672 1,408 2,688 ...

Page 2

... Fine Ball Grid Array (1.0mm pitch Chip Scale Package (0.8mm pitch Plastic Quad Flat Pack (0.5mm pitch Ceramic Quad Flat Pack (0.5mm pitch Ceramic Column Grid Array User I/Os (Including Clock Buffers) AX250 AX500 – – 115 115 115 115 – – ...

Page 3

... M = Military Packaging Data Refer to the following documents located on the Actel website for additional packaging information. Package Mechanical Drawings Package Thermal Characteristics and Weights Hermatic Package Mechanical Information Contact your local Actel representative for device availability. AX250 AX500 – – – – – ...

Page 4

Axcelerator Family FPGAs Table of Contents General Description Device Architecture . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ...

Page 5

Table of Contents 1152-Pin FBGA . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ...

Page 6

...

Page 7

General Description Axcelerator offers high performance at densities two million equivalent system gates. Based upon the Actel AX architecture, Axcelerator has several system- level features such as embedded SRAM (with complete FIFO control logic), PLLs, segmentable clocks, ...

Page 8

Axcelerator Family FPGAs Figure 1-2 • Axcelerator Family Interconnect Elements Logic Modules Actel's Axcelerator family provides two types of logic modules: the register cell (R-cell) and the combinatorial cell (C-cell). The can implement more than 4,000 combinatorial functions of up ...

Page 9

... DB CFN Figure 1-3 • AX C-Cell and R-Cell C C Figure 1-4 • AX SuperCluster Figure 1-5 • AX 2-bit Carry Logic Table 1-1 • Number of Core Tiles per Device Device AX125 AX250 AX500 AX1000 AX2000 FCI D E C-cell Y CLK (Positive Edge Triggered) FCO C-Cell ...

Page 10

Axcelerator Family FPGAs Chip Layout I/O Structure See Figure 7 Figure 1-6 • AX Device Architecture (AX1000 shown) Embedded Memory As mentioned earlier, each core tile has either three (in a smaller tile) or four (in the regular tile) embedded ...

Page 11

RAM/ FIFO RAM/ FIFO 4k RAM/ FIFO 4k RAM/ FIFO Figure 1-7 • I/O Cluster Arrangement Routing The AX hierarchical routing structure ties the logic modules, the embedded memory blocks, and the ...

Page 12

Axcelerator Family FPGAs Figure 1-8 • AX Routing Structures operating with input frequencies ranging from 14 MHz to 200 MHz and can generate output frequencies between 20 MHz and 1 GHz. The clock can be either divided or multiplied by ...

Page 13

With the Designer software, a user can lock the design pins before layout while minimally impacting the results of place-and-route. Additionally, Actel’s back-annotation flow is compatible with all the major simulators and the simulation results can be cross-probed with Silicon ...

Page 14

Axcelerator Family FPGAs Related Documents Application Notes Simultaneous Switching Noise and Signal Integrity http://www.actel.com/documents/SSN_AN.pdf Axcelerator Family PLL and Clock Management http://www.actel.com/documents/AX_PLL_AN.pdf Implementation of Security in Actel Antifuse FPGAs http://www.actel.com/documents/Antifuse_Security_AN.pdf User’s Guides and Manuals Antifuse Macro Library Guide http://www.actel.com/documents/libguide_UG.pdf SmartGen, FlashROM, ...

Related keywords