TDA9886TS NXP Semiconductors, TDA9886TS Datasheet - Page 51

no-image

TDA9886TS

Manufacturer Part Number
TDA9886TS
Description
Manufacturer
NXP Semiconductors
Datasheet

Specifications of TDA9886TS

Lead Free Status / Rohs Status
Not Compliant

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
TDA9886TS
Manufacturer:
PHI
Quantity:
1 000
Part Number:
TDA9886TS
Manufacturer:
PHILIPS
Quantity:
1 000
Part Number:
TDA9886TS
Manufacturer:
NXP/恩智浦
Quantity:
20 000
Company:
Part Number:
TDA9886TS
Quantity:
715
Part Number:
TDA9886TS/N4
Manufacturer:
NXP/恩智浦
Quantity:
20 000
Part Number:
TDA9886TS/V4
Manufacturer:
PHILIPS/飞利浦
Quantity:
20 000
Part Number:
TDA9886TS/V4/S2
Manufacturer:
NXP/PBF
Quantity:
980
Part Number:
TDA9886TS/V5
Manufacturer:
NXP/恩智浦
Quantity:
20 000
Part Number:
TDA9886TS/V5,118
Manufacturer:
NXP Semiconductors
Quantity:
850
NXP Semiconductors
21. Contents
1
2
3
4
5
6
7
7.1
7.2
8
8.1
8.2
8.3
8.4
8.5
8.6
8.7
8.8
8.9
8.10
8.11
8.12
8.13
8.14
8.15
8.16
9
9.1
9.1.1
9.1.2
9.2
9.2.1
9.2.2
9.2.3
9.2.4
10
11
12
13
14
15
16
16.1
16.2
16.3
General description . . . . . . . . . . . . . . . . . . . . . . 1
Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2
Quick reference data . . . . . . . . . . . . . . . . . . . . . 2
Ordering information . . . . . . . . . . . . . . . . . . . . . 4
Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . 5
Pinning information . . . . . . . . . . . . . . . . . . . . . . 6
Functional description . . . . . . . . . . . . . . . . . . . 8
I
Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . 21
Thermal characteristics. . . . . . . . . . . . . . . . . . 21
Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . 22
Application information. . . . . . . . . . . . . . . . . . 45
Test information . . . . . . . . . . . . . . . . . . . . . . . . 46
Package outline . . . . . . . . . . . . . . . . . . . . . . . . 48
Soldering of SMD packages . . . . . . . . . . . . . . 51
2
C-bus control . . . . . . . . . . . . . . . . . . . . . . . . . 14
Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 7
VIF amplifier . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
Tuner AGC and VIF AGC . . . . . . . . . . . . . . . . . 8
VIF-AGC detector . . . . . . . . . . . . . . . . . . . . . . . 9
FPLL detector . . . . . . . . . . . . . . . . . . . . . . . . . . 9
VCO and divider . . . . . . . . . . . . . . . . . . . . . . . . 9
AFC and digital acquisition help . . . . . . . . . . . 10
Video demodulator and amplifier . . . . . . . . . . 10
Sound carrier trap . . . . . . . . . . . . . . . . . . . . . . 11
SIF amplifier . . . . . . . . . . . . . . . . . . . . . . . . . . 11
SIF-AGC detector . . . . . . . . . . . . . . . . . . . . . . 11
Single reference QSS mixer . . . . . . . . . . . . . . 11
AM demodulator . . . . . . . . . . . . . . . . . . . . . . . 12
FM demodulator and acquisition help. . . . . . . 12
Audio amplifier and mute time constant . . . . . 12
Internal voltage stabilizer . . . . . . . . . . . . . . . . 13
I
Read format . . . . . . . . . . . . . . . . . . . . . . . . . . 14
Slave address . . . . . . . . . . . . . . . . . . . . . . . . . 14
Data byte . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
Write format . . . . . . . . . . . . . . . . . . . . . . . . . . 16
Subaddress (A data). . . . . . . . . . . . . . . . . . . . 17
Data byte for switching mode (B data) . . . . . . 17
Data byte for adjust mode (C data). . . . . . . . . 18
Data byte for data mode (E data) . . . . . . . . . . 19
Introduction to soldering . . . . . . . . . . . . . . . . . 51
Wave and reflow soldering . . . . . . . . . . . . . . . 51
Wave soldering . . . . . . . . . . . . . . . . . . . . . . . . 51
2
C-bus transceiver and MAD . . . . . . . . . . . . . 13
I
2
C-bus controlled multistandard alignment-free IF-PLL demodulators
16.4
17
18
19
19.1
19.2
19.3
19.4
20
21
Please be aware that important notices concerning this document and the product(s)
described herein, have been included in section ‘Legal information’.
© NXP B.V. 2008.
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: salesaddresses@nxp.com
Abbreviations . . . . . . . . . . . . . . . . . . . . . . . . . 53
Revision history . . . . . . . . . . . . . . . . . . . . . . . 54
Legal information . . . . . . . . . . . . . . . . . . . . . . 55
Contact information . . . . . . . . . . . . . . . . . . . . 55
Contents. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 56
Reflow soldering. . . . . . . . . . . . . . . . . . . . . . . 52
Data sheet status . . . . . . . . . . . . . . . . . . . . . . 55
Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . 55
Disclaimers. . . . . . . . . . . . . . . . . . . . . . . . . . . 55
Trademarks . . . . . . . . . . . . . . . . . . . . . . . . . . 55
TDA9885; TDA9886
Document identifier: TDA9885_TDA9886_3
Date of release: 16 December 2008
All rights reserved.

Related parts for TDA9886TS