H27UAG8T2ATR-BC HYNIX SEMICONDUCTOR, H27UAG8T2ATR-BC Datasheet - Page 22
H27UAG8T2ATR-BC
Manufacturer Part Number
H27UAG8T2ATR-BC
Description
58T1891
Manufacturer
HYNIX SEMICONDUCTOR
Datasheet
1.H27UAG8T2ATR-BC.pdf
(61 pages)
Specifications of H27UAG8T2ATR-BC
Memory Type
Flash - NAND
Memory Size
16Gbit
Memory Configuration
2048M X 8
Supply Voltage Range
2.7V To 3.6V
Memory Case Style
TSOP
No. Of Pins
48
Operating Temperature Range
0°C To +70°C
Rohs Compliant
Yes
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
H27UAG8T2ATR-BC
Manufacturer:
HYNIX
Quantity:
2 526
Company:
Part Number:
H27UAG8T2ATR-BC
Manufacturer:
SIEMENS
Quantity:
390
Company:
Part Number:
H27UAG8T2ATR-BC
Manufacturer:
HYNIX
Quantity:
4 000
Part Number:
H27UAG8T2ATR-BC
Manufacturer:
HYNIX/海力士
Quantity:
20 000
Rev 1.0 / Aug. 2010
3. Timing Diagram
Bus Operation
There are six standard bus operations that control the device. These are Command Input, Address Input, Data Input,
Data Output, Write Protect, and Standby.
3.1. Command Latch Cycle Timings
Note:
All commands except Reset, Read Status, and Multi Plane Read Status are issued to command register on the rising edge of WE#,
when CLE is high, CE# and ALE is low, and device is not busy state
■
Figure 6. Command latch timings
WE#
CLE
ALE
I/Ox
CE#
t
WP
t
t
CLS
CS
t
t
ALS
DS
Command
t
t
t
t
ALH
CH
CLH
DH
16Gb (2048M x 8bit) NAND Flash
H27UAG8T2B Series
: Don’t care
Release
22