TE28F800C3TA90 Intel, TE28F800C3TA90 Datasheet - Page 11

• Manufacturer Part Number: TE28F800C3TA90
• Description: Flash Mem Parallel 3V/3.3V 8M-Bit 512K x 16 90ns 48-Pin TSOP
• Manufacturer: Intel

Specifications of TE28F800C3TA90

• Package: 48TSOP
• Density: 8 Mb
• Architecture: Sectored
• Block Organization: Asymmetrical
• Location Of Boot Block: Top
• Typical Operating Supply Voltage: 3|3.3 V
• Sector Size: 8KByte x 8|64KByte x 15
• Support Of Common Flash Interface: Yes
• Timing Type: Asynchronous
• Operating Temperature: -40 to 85 °C
• Interface Type: Parallel

Datasheet
Figure 3. 48-Ball µBGA* and 48-Ball Very Fine Pitch BGA (VF BGA) Chip Size Package
A
B
C
D
E
F
GND
V
A13
A14
A15
A16
CCQ
1
(Top View, Ball Down)
NOTES:
1. Shaded connections indicate the upgrade address connections. Routing is not recommended in this area.
2. A19 denotes 16 Mbit; A20 denotes 32 Mbit; A21 denotes 64 Mbit.
3. Unused address balls are not populated.
A11
A10
A12
D14
D15
D7
2
WE#
D13
D5
D6
A8
A9
3
1,2,3
64M
VPP
RP#
D11
D12
A21
D4
4
32M
Intel
£
WP#
VCC
A18
A20
D2
D3
5
Advanced+ Boot Block Flash Memory (C3)
16M
D10
A19
A17
D8
D9
A6
6
CE#
D0
D1
A7
A5
A3
7
GND
OE#
A4
A2
A1
A0
8
11