LPC1776FBD208,551 NXP Semiconductors, LPC1776FBD208,551 Datasheet - Page 107
![no-image](/images/manufacturer_photos/0/4/487/nxp_semiconductors_sml.jpg)
LPC1776FBD208,551
Manufacturer Part Number
LPC1776FBD208,551
Description
IC MCU 32BIT 256KB FLASH 208LQFP
Manufacturer
NXP Semiconductors
Series
LPC17xxr
Datasheet
1.LPC1774FBD208551.pdf
(117 pages)
Specifications of LPC1776FBD208,551
Core Processor
ARM® Cortex-M3™
Core Size
32-Bit
Speed
120MHz
Connectivity
CAN, EBI/EMI, Ethernet, I²C, Microwire, MMC, SPI, SSI, SSP, UART/USART, USB OTG
Peripherals
Brown-out Detect/Reset, DMA, I²S, Motor Control PWM, POR, PWM, WDT
Number Of I /o
165
Program Memory Size
256KB (256K x 8)
Program Memory Type
FLASH
Eeprom Size
4K x 8
Ram Size
80K x 8
Voltage - Supply (vcc/vdd)
2.4 V ~ 3.6 V
Data Converters
A/D 8x12b, D/A 1x10b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Package / Case
208-LQFP
Lead Free Status / Rohs Status
Lead free / RoHS Compliant
Other names
568-7568
LPC1776FBD208,551
LPC1776FBD208,551
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
LPC1776FBD208,551
Manufacturer:
NXP Semiconductors
Quantity:
10 000
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NXP Semiconductors
Fig 44. TFBGA180 package
LPC178X_7X
Objective data sheet
TFBGA180: thin fine-pitch ball grid array package; 180 balls; body 12 x 12 x 0.8 mm
DIMENSIONS (mm are the original dimensions)
UNIT
mm
VERSION
OUTLINE
SOT570-2
ball A1
index area
ball A1
index area
max.
1.2
A
0.35
0.25
A
P
N
M
K
H
G
E
D
C
B
A
1
L
J
F
0.85
0.75
1
A
2
2
e
IEC
3
0.5
0.4
b
4
5
12.2
11.8
6
D
7
e
D
1
12.2
11.8
8
E
All information provided in this document is subject to legal disclaimers.
9
1/2 e
JEDEC
10
0.8
0
11
e
REFERENCES
12
b
10.4
Rev. 2 — 27 May 2011
13 14
e
1
10.4
e
1/2 e
2
JEITA
scale
B
e
5
∅ w
∅ v
0.15
e
A
v
E
2
M
M
C
C
0.08
w
A
B
0.12
y
10 mm
A
32-bit ARM Cortex-M3 microcontroller
A
0.1
y
2
1
y
1
A
C
1
PROJECTION
EUROPEAN
detail X
LPC178x/7x
C
X
y
© NXP B.V. 2011. All rights reserved.
ISSUE DATE
03-03-03
06-03-14
SOT570-2
107 of 117
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