LPC1787FBD208,551 NXP Semiconductors, LPC1787FBD208,551 Datasheet - Page 5
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LPC1787FBD208,551
Manufacturer Part Number
LPC1787FBD208,551
Description
IC MCU 32BIT 512KB FLASH 208LQFP
Manufacturer
NXP Semiconductors
Series
LPC17xxr
Datasheet
1.LPC1774FBD208551.pdf
(117 pages)
Specifications of LPC1787FBD208,551
Core Processor
ARM® Cortex-M3™
Core Size
32-Bit
Speed
120MHz
Connectivity
CAN, EBI/EMI, I²C, Microwire, MMC, SPI, SSI, SSP, UART/USART, USB OTG
Peripherals
Brown-out Detect/Reset, DMA, I²S, LCD, Motor Control PWM, POR, PWM, WDT
Number Of I /o
165
Program Memory Size
512KB (512K x 8)
Program Memory Type
FLASH
Eeprom Size
4K x 8
Ram Size
96K x 8
Voltage - Supply (vcc/vdd)
2.4 V ~ 3.6 V
Data Converters
A/D 8x12b, D/A 1x10b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Package / Case
208-LQFP
Lead Free Status / Rohs Status
Lead free / RoHS Compliant
Other names
568-7575
LPC1787FBD208,551
LPC1787FBD208,551
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
LPC1787FBD208,551
Manufacturer:
NXP Semiconductors
Quantity:
10 000
NXP Semiconductors
4. Ordering information
Table 1.
LPC178X_7X
Objective data sheet
Type number
LPC1788
LPC1788FBD208
LPC1788FET208
LPC1788FET180
LPC1788FBD144
LPC1787
LPC1787FBD208
LPC1786
LPC1786FBD208
LPC1785
LPC1785FBD208
LPC1778
LPC1778FBD208
LPC1778FET208
LPC1778FET180
LPC1778FBD144
LPC1777
LPC1777FBD208
LPC1776
LPC1776FBD208
LPC1776FET180
LPC1774
LPC1774FBD208
LPC1774FBD144
Ordering information
Package
Name
LQFP208
TFBGA208
TFBGA180
LQFP144
LQFP208
LQFP208
LQFP208
LQFP208
TFBGA208
TFBGA180
LQFP144
LQFP208
LQFP208
TFBGA180
LQFP208
LQFP144
Description
plastic low profile quad flat package; 208 leads; body 28 28 1.4 mm
plastic thin fine-pitch ball grid array package; 208 balls; body
15 15 0.7 mm
thin fine-pitch ball grid array package; 180 balls; body 12 12 0.8 mm
plastic low profile quad flat package; 144 leads; body 20 20 1.4 mm
plastic low profile quad flat package; 208 leads; body 28 28 1.4 mm
plastic low profile quad flat package; 208 leads; body 28 28 1.4 mm
plastic low profile quad flat package; 208 leads; body 28 28 1.4 mm
plastic low profile quad flat package; 208 leads; body 28 28 1.4 mm
plastic thin fine-pitch ball grid array package; 208 balls; body
15 15 0.7 mm
thin fine-pitch ball grid array package; 180 balls; body 12 12 0.8 mm
plastic low profile quad flat package; 144 leads; body 20 20 1.4 mm
plastic low profile quad flat package; 208 leads; body 28 28 1.4 mm
plastic low profile quad flat package; 208 leads; body 28 28 1.4 mm
thin fine-pitch ball grid array package; 180 balls; body 12 12 0.8 mm
plastic low profile quad flat package; 208 leads; body 28 28 1.4 mm
plastic low profile quad flat package; 144 leads; body 20 20 1.4 mm
All information provided in this document is subject to legal disclaimers.
Rev. 2 — 27 May 2011
32-bit ARM Cortex-M3 microcontroller
LPC178x/7x
© NXP B.V. 2011. All rights reserved.
Version
SOT459-1
SOT950-1
SOT570-2
SOT486-1
SOT459-1
SOT486-1
SOT459-1
SOT459-1
SOT459-1
SOT950-1
SOT570-2
SOT486-1
SOT459-1
SOT459-1
SOT570-2
SOT459-1
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