PIC18F4585-H/PT Microchip Technology, PIC18F4585-H/PT Datasheet - Page 457

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PIC18F4585-H/PT

Manufacturer Part Number
PIC18F4585-H/PT
Description
IC MCU 8BIT 48KB FLASH 44TQFP
Manufacturer
Microchip Technology
Series
PIC® 18Fr
Datasheet

Specifications of PIC18F4585-H/PT

Core Processor
PIC
Core Size
8-Bit
Speed
25MHz
Connectivity
CAN, I²C, SPI, UART/USART
Peripherals
Brown-out Detect/Reset, HLVD, POR, PWM, WDT
Number Of I /o
36
Program Memory Size
48KB (24K x 16)
Program Memory Type
FLASH
Eeprom Size
1K x 8
Ram Size
3.25K x 8
Voltage - Supply (vcc/vdd)
4.2 V ~ 5.5 V
Data Converters
A/D 11x10b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 150°C
Package / Case
44-TQFP
Lead Free Status / Rohs Status
Lead free / RoHS Compliant
29.2
The following sections give the technical details of the packages.
© 2007 Microchip Technology Inc.
28-Lead Skinny Plastic Dual In-Line (SP) – 300 mil Body [SPDIP]
Notes:
1. Pin 1 visual index feature may vary, but must be located within the hatched area.
2. § Significant Characteristic.
3. Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed .010" per side.
4. Dimensioning and tolerancing per ASME Y14.5M.
NOTE 1
A1
Note:
A
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
Package Details
N
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
1
2
Number of Pins
Pitch
Top to Seating Plane
Molded Package Thickness
Base to Seating Plane
Shoulder to Shoulder Width
Molded Package Width
Overall Length
Tip to Seating Plane
Lead Thickness
Upper Lead Width
Lower Lead Width
Overall Row Spacing §
3
b
b1
D
PIC18F2585/2680/4585/4680
Dimension Limits
Preliminary
Units
A2
A1
E1
eB
b1
N
D
A
E
b
e
L
c
e
1.345
.120
.015
.290
.240
.008
.040
.014
A2
MIN
.110
E1
L
.100 BSC
INCHES
1.365
NOM
.050
.018
.135
.310
.285
.130
.010
28
Microchip Technology Drawing C04-070B
eB
E
1.400
MAX
.070
.022
.200
.150
.335
.295
.150
.015
.430
DS39625C-page 455
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