AD8150AST Analog Devices Inc, AD8150AST Datasheet - Page 28

• Manufacturer Part Number: AD8150AST
• Description: IC CROSSPOINT SWIT 33X17 184LQFP
• Manufacturer: Analog Devices Inc

Specifications of AD8150AST

• Rohs Status: RoHS non-compliant
• Function: Crosspoint Switch
• Circuit: 1 x 33:17
• Voltage Supply Source: Dual Supply
• Voltage - Supply, Single/dual (±): ±3 V ~ 5.5 V
• Operating Temperature: 0°C ~ 85°C
• Mounting Type: Surface Mount
• Package / Case: 184-LQFP
• Number Of Arrays: 1
• Differential Data Transmission: Yes
• Operating Supply Voltage (typ): Not RequiredV
• Mounting: Surface Mount
• Operating Temperature (max): 85C
• Cascading Capability: No
• Line Code: NRZ
• On-chip Buffers: Yes
• On-chip Mux/demux: No
• Operating Supply Voltage (max): Not RequiredV
• Operating Supply Voltage (min): Not RequiredV
• Dual Supply Voltage (typ): 3.3V
• Lead Free Status / RoHS Status: Not Compliant

AD8150
HEAT SINKING
Depending on several factors in its operation, the AD8150 can
dissipate 2 W or more. The part is designed to operate without
the need for an explicit external heat sink. However, the package
design offers enhanced heat removal via some of the package
pins to the PC board traces.
The V
Pins 93 to 138) have finger extensions inside the package that
connect to the paddle on which the IC chip is mounted. These
pins provide a lower thermal resistance from the IC to the V
pins than pins that just have a bond wire. As a result, these pins
can be used to enhance the heat removal process from the IC to
the circuit board and ultimately to the ambient.
The V
area of circuit board trace material to take the most advantage
of their lower thermal resistance. If there is a large area available
on an inner layer that is at V
provided from the package pin traces to this layer. There should
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pins on the input sides of the package (Pins 1 to 46 and
pins described above should be connected to a large
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potential, then vias can be
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Rev. A | Page 28 of 44
be no thermal-relief pattern when connecting the vias to the
inner layers for these V
close to the pin leads can provide an even lower thermal
resistive path. If possible to use, 2 oz. copper foil will provide
better heat removal than 1 oz.
The AD8150 package has a specified thermal impedance, θ
30°C/W. This is the worst case still-air value that can be
expected when the circuit board does not significantly enhance
the heat removal from the package. By using the concept
described above or by using forced-air circulation, the thermal
impedance can be lowered.
For an extreme worst case analysis, the junction rise above the
ambient can be calculated assuming 2 W of power dissipation
and θ
are many techniques described above that can mitigate this
situation. Most actual circuits will not result in such a high rise
of the junction temperature above the ambient.
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of 30°C/W to yield a 60°C rise above the ambient. There
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pins. Additional vias in parallel and
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, of