TDA6651TTC1 NXP Semiconductors, TDA6651TTC1 Datasheet - Page 48

TDA6651TTC1

Manufacturer Part Number
TDA6651TTC1
Description
Manufacturer
NXP Semiconductors
Datasheet

Specifications of TDA6651TTC1

Package Type
TSSOP
Lead Free Status / Rohs Status
Compliant
NXP Semiconductors
14. Package outline
Fig 31. Package outline SOT510-1 (TSSOP38)
TDA6650TT_6651TT_5
Product data sheet
TSSOP38: plastic thin shrink small outline package; 38 leads; body width 4.4 mm;
lead pitch 0.5 mm
DIMENSIONS (mm are the original dimensions).
Notes
1. Plastic or metal protrusions of 0.15 mm maximum per side are not included.
2. Plastic interlead protrusions of 0.25 mm maximum per side are not included.
UNIT
mm
OUTLINE
VERSION
SOT510-1
38
1
max.
1.1
A
y
Z
0.15
0.05
A
1
pin 1 index
0.95
0.85
A
2
IEC
0.25
A
3
e
D
0.27
0.17
b
p
0.20
0.09
MO-153
JEDEC
c
REFERENCES
0
D
9.8
9.6
Rev. 05 — 10 January 2007
(1)
E
4.5
4.3
(2)
b
p
JEITA
scale
2.5
0.5
19
20
e
w
5 V mixer/oscillator and low noise PLL synthesizer
M
TDA6650TT; TDA6651TT
H
6.4
c
E
A
2
A
L
1
5 mm
1
0.7
0.5
L
p
0.2
v
E
H
E
PROJECTION
EUROPEAN
detail X
0.08
w
L
L
0.08
p
y
0.49
0.21
(A )
Z
A
© NXP B.V. 2007. All rights reserved.
(1)
3
ISSUE DATE
03-02-18
05-11-02
X
8
0
A
o
o
v
SOT510-1
M
A
48 of 54

Related parts for TDA6651TTC1