SI3220-G-GQ Silicon Laboratories Inc, SI3220-G-GQ Datasheet - Page 5
![IC PROSLIC/CODEC DUAL 64TQFP](/photos/16/12/161288/tqfp-64_sml.jpg)
SI3220-G-GQ
Manufacturer Part Number
SI3220-G-GQ
Description
IC PROSLIC/CODEC DUAL 64TQFP
Manufacturer
Silicon Laboratories Inc
Series
ProSLIC®r
Datasheet
1.SI3200-G-FSR.pdf
(112 pages)
Specifications of SI3220-G-GQ
Package / Case
64-TQFP, 64-VQFP
Function
Subscriber Line Interface Concept (SLIC), CODEC
Interface
GCI, PCM, SPI
Number Of Circuits
2
Voltage - Supply
3.3V, 5V
Current - Supply
65mA
Power (watts)
941mW
Operating Temperature
-40°C ~ 85°C
Mounting Type
Surface Mount
Includes
Battery Switching, BORSCHT Functions, DTMF Generation and Decoding, FSK Tone Generation, Modem and Fax Tone Detection
Product
SLIC
Supply Voltage (min)
3.13 V
Supply Current
22 mA
Maximum Operating Temperature
+ 85 C
Minimum Operating Temperature
- 40 C
Mounting Style
SMD/SMT
Number Of Channels
2
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Lead Free Status / RoHS Status
Lead free / RoHS Compliant, Lead free / RoHS Compliant
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
SI3220-G-GQ
Manufacturer:
CREATIVE
Quantity:
99
Company:
Part Number:
SI3220-G-GQ
Manufacturer:
Silicon Laboratories Inc
Quantity:
10 000
Company:
Part Number:
SI3220-G-GQR
Manufacturer:
SILICON
Quantity:
15 000
Company:
Part Number:
SI3220-G-GQR
Manufacturer:
Silicon Laboratories Inc
Quantity:
10 000
Table 1. Absolute Maximum Ratings and Thermal Information
High Battery Supply Voltage
Low Battery Supply Voltage
TIP or RING Voltage
TIP or RING Current
Thermal Information
Operating temperature (All devices)
Storage temperature (All devices)
Thermal Resistance (Si3220/Si3225)
Thermal Resistance (Si3200/Si3202)
Notes:
1. Permanent device damage may occur if the absolute maximum ratings are exceeded, and exposure to absolute
2. The PCB pad placed under the device package must be connected with multiple vias to the PCB ground layer and to
3. On Si3200 revision E, the dv/dt of the voltage applied to the V
4. Operation of the Si3220/Si3225 above 125 °C junction temperature may degrade device reliability. The Si3200/Si3202
5. The thermal resistance of an exposed pad package is assured when the recommended printed circuit board layout
maximum rating conditions for extended periods may affect device reliability. Functional operation should be restricted
to the conditions as specified in the operational sections of this data sheet.
the GND1-GND4 pins via short traces. The TQFP-64 e-Pad must be properly soldered to the PCB pad during PCB
assembly. This type of low-impedance grounding arrangement is necessary to ensure that maximum differentials are
not exceeded under any operating condition in addition to providing thermal dissipation.
should be operated at a junction temperature below 140 °C for optimal reliability.
guidelines are followed correctly. The specified performance requires that the exposed pad be soldered to an exposed
copper surface of equal size and that multiple vias are added to enable heat transfer between the top-side copper
surface and a large internal copper ground plane. Refer to “AN55: Dual ProSLIC
evaluation board data sheet for specific layout examples.
Parameter
4
5
5
Rev. 1.3
I
Symbol
TIP
V
V
V
V
V
θ
θ
BATH
RING
, I
BATL
BAT
TIP
JA
JA
RING
,
,
BAT
, V
Test Condition
TQFP-64 ePad
SOIC-16 ePad
Pulse < 10 us
BATH
Pulse < 4 us
Si3220/25 Si3200/02
Continuous
Continuous
Continuous
10 ms
1
, and V
(Continued)
BATL
®
User Guide” or to the Si3220/3225
pins must be limited to 10 V/µs.
V
V
BATH
BATH
V
–130
–135
–130
–100
Min
–40
–40
BATH
25 (typical)
55 (typical)
–15
–35
+100
+100
+150
Max
0.4
0.4
0.4
0.4
0.4
0.4
°C/W
°C/W
Unit
mA
°C
°C
V
V
V
V
V
V
5