PCF2123BS/1 NXP Semiconductors, PCF2123BS/1 Datasheet - Page 52

• Manufacturer Part Number: PCF2123BS/1
• Manufacturer: NXP Semiconductors

Specifications of PCF2123BS/1

• Lead Free Status / Rohs Status: Compliant

NXP Semiconductors
17. Handling information
18. Packing information
PCF2123
Product data sheet
Fig 36. PCF2123Ux wafer information
1.449 mm
(1) Die marking code.
Seal ring plus gap to active circuit ~18 μm.
1
1
All input and output pins are protected against ElectroStatic Discharge (ESD) under
normal handling. When handling Metal-Oxide Semiconductor (MOS) devices ensure that
all normal precautions are taken as described in JESD625-A, IEC 61340-5 or equivalent
standards.
Table 50.
[1]
Type number
PCF2123U/5GA/1
PCF2123U/10AA/1
PCF2123U/12AA/1
PCF2123U/12HA/1
1.492 mm
Wafer mapping information will be distributed to customer’s ftp server.
X
straight edge
of the wafer
PCF2123Ux wafer information
(1)
All information provided in this document is subject to legal disclaimers.
1
1
Wafer thickness (μm) Wafer diameter
687
200
200
150
Rev. 5 — 27 April 2011
45 μm
6 inch
6 inch
6 inch
6 inch
SPI Real time clock/calendar
Saw lane
detail X
~18 μm
Marking of bad die
wafer mapping
inking
wafer mapping
inking
70 μm
PCF2123
© NXP B.V. 2011. All rights reserved.
013aaa232
[1]
[1]
~18 μm
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