SC68C752BIB48,128 NXP Semiconductors, SC68C752BIB48,128 Datasheet - Page 44

• Manufacturer Part Number: SC68C752BIB48,128
• Description: IC UART DUAL 48LQFP
• Manufacturer: NXP Semiconductors

Specifications of SC68C752BIB48,128

• Number Of Channels: 2, DUART
• Fifo's: 64 Byte
• Voltage - Supply: 2.5V, 3.3V, 5V
• With Auto Flow Control: Yes
• With False Start Bit Detection: Yes
• With Modem Control: Yes
• Mounting Type: Surface Mount
• Package / Case: 48-LQFP
• Transmit Fifo: 64Byte
• Receive Fifo: 64Byte
• Transmitter And Receiver Fifo Counter: Yes
• Data Rate: 5Mbps
• Package Type: LQFP
• Operating Supply Voltage (max): 5.5V
• Mounting: Surface Mount
• Pin Count: 48
• Operating Temperature (min): -40C
• Operating Temperature (max): 85C
• Operating Temperature Classification: Industrial
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Other names: 935278767128; SC68C752BIB48-F; SC68C752BIB48-F

NXP Semiconductors
SC68C752B_4
Product data sheet
13.4 Reflow soldering
Key characteristics in reflow soldering are:
Table 28.
Table 29.
Moisture sensitivity precautions, as indicated on the packing, must be respected at all
times.
Studies have shown that small packages reach higher temperatures during reflow
soldering, see
Package thickness (mm)
< 2.5
≥ 2.5
Package thickness (mm)
< 1.6
1.6 to 2.5
> 2.5
•
•
•
Lead-free versus SnPb soldering; note that a lead-free reflow process usually leads to
higher minimum peak temperatures (see
reducing the process window
Solder paste printing issues including smearing, release, and adjusting the process
window for a mix of large and small components on one board
Reflow temperature profile; this profile includes preheat, reflow (in which the board is
heated to the peak temperature) and cooling down. It is imperative that the peak
temperature is high enough for the solder to make reliable solder joints (a solder paste
characteristic). In addition, the peak temperature must be low enough that the
packages and/or boards are not damaged. The peak temperature of the package
depends on package thickness and volume and is classified in accordance with
Table 28
SnPb eutectic process (from J-STD-020C)
Lead-free process (from J-STD-020C)
and
Figure
29
5 V, 3.3 V and 2.5 V dual UART, 5 Mbit/s (max.), with 64-byte FIFOs
26.
Rev. 04 — 20 January 2010
Package reflow temperature (°C)
Volume (mm
< 350
235
220
Package reflow temperature (°C)
Volume (mm
< 350
260
260
250
3
3
)
)
Figure
350 to 2000
260
250
245
26) than a SnPb process, thus
≥ 350
220
220
SC68C752B
245
> 2000
260
245
© NXP B.V. 2010. All rights reserved.
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