SC16IS762IBS-T NXP Semiconductors, SC16IS762IBS-T Datasheet - Page 56

• Manufacturer Part Number: SC16IS762IBS-T
• Description: IC UART DUAL I2C/SPI 32-HVQFN
• Manufacturer: NXP Semiconductors

Specifications of SC16IS762IBS-T

• Features: Low Current
• Number Of Channels: 2, DUART
• Fifo's: 64 Byte
• Protocol: RS232, RS485
• Voltage - Supply: 2.5V, 3.3V
• With Auto Flow Control: Yes
• With False Start Bit Detection: Yes
• With Modem Control: Yes
• Mounting Type: Surface Mount
• Package / Case: 32-VFQFN Exposed Pad
• For Use With: 568-4000 - DEMO BOARD SPI/I2C TO DUAL UART568-3510 - DEMO BOARD SPI/I2C TO UART
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

NXP Semiconductors
18. Abbreviations
SC16IS752_SC16IS762_7
Product data sheet
For further information on temperature profiles, refer to Application Note AN10365
“Surface mount reflow soldering description” .
Table 42.
Acronym
CPU
DLL
DLH
FIFO
GPIO
I
IrDA
LCD
MIR
POR
SIR
SPI
SPR
UART
2
Fig 39. Temperature profiles for large and small components
C-bus
temperature
MSL: Moisture Sensitivity Level
Abbreviations
Description
Central Processing Unit
Divisor Latch LSB
Divisor Latch MSB
First In, First Out
General Purpose Input/Output
Inter IC bus
Infrared Data Association
Liquid Crystal Display
Medium InfraRed
Power-On Reset
Serial InfraRed
Serial Peripheral Interface
ScratchPad Register
Universal Asynchronous Receiver/Transmitter
Dual UART with I
Rev. 07 — 19 May 2008
= minimum soldering temperature
maximum peak temperature
minimum peak temperature
= MSL limit, damage level
2
SC16IS752/SC16IS762
C-bus/SPI interface, 64-byte FIFOs, IrDA SIR
temperature
peak
© NXP B.V. 2008. All rights reserved.
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