SC16C554IB64,157 NXP Semiconductors, SC16C554IB64,157 Datasheet - Page 50
![IC UART QUAD W/FIFO 64-LQFP](/photos/6/98/69856/568-64-lqfp_sot314-2_sml.jpg)
SC16C554IB64,157
Manufacturer Part Number
SC16C554IB64,157
Description
IC UART QUAD W/FIFO 64-LQFP
Manufacturer
NXP Semiconductors
Specifications of SC16C554IB64,157
Number Of Channels
4, QUART
Fifo's
16 Byte
Voltage - Supply
2.5V, 3.3V, 5V
With Auto Flow Control
Yes
With Irda Encoder/decoder
Yes
With False Start Bit Detection
Yes
With Modem Control
Yes
With Cmos
Yes
Mounting Type
Surface Mount
Package / Case
64-LQFP
Transmit Fifo
16Byte
Receive Fifo
16Byte
Transmitter And Receiver Fifo Counter
Yes
Data Rate
5Mbps
Package Type
LQFP
Operating Supply Voltage (max)
5.5V
Operating Supply Voltage (min)
4.5V
Mounting
Surface Mount
Operating Temperature (min)
-40C
Operating Temperature (max)
85C
Operating Temperature Classification
Industrial
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Other names
568-1321
935270074157
SC16C554IB64
935270074157
SC16C554IB64
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
SC16C554IB64,157
Manufacturer:
NXP Semiconductors
Quantity:
10 000
Philips Semiconductors
12. Soldering
9397 750 13132
Product data
12.1 Introduction to soldering surface mount packages
12.2 Reflow soldering
12.3 Wave soldering
This text gives a very brief insight to a complex technology. A more in-depth account
of soldering ICs can be found in our Data Handbook IC26; Integrated Circuit
Packages (document order number 9398 652 90011).
There is no soldering method that is ideal for all surface mount IC packages. Wave
soldering can still be used for certain surface mount ICs, but it is not suitable for fine
pitch SMDs. In these situations reflow soldering is recommended. In these situations
reflow soldering is recommended.
Reflow soldering requires solder paste (a suspension of fine solder particles, flux and
binding agent) to be applied to the printed-circuit board by screen printing, stencilling
or pressure-syringe dispensing before package placement. Driven by legislation and
environmental forces the worldwide use of lead-free solder pastes is increasing.
Several methods exist for reflowing; for example, convection or convection/infrared
heating in a conveyor type oven. Throughput times (preheating, soldering and
cooling) vary between 100 and 200 seconds depending on heating method.
Typical reflow peak temperatures range from 215 to 270 C depending on solder
paste material. The top-surface temperature of the packages should preferably be
kept:
Moisture sensitivity precautions, as indicated on packing, must be respected at all
times.
Conventional single wave soldering is not recommended for surface mount devices
(SMDs) or printed-circuit boards with a high component density, as solder bridging
and non-wetting can present major problems.
To overcome these problems the double-wave soldering method was specifically
developed.
If wave soldering is used the following conditions must be observed for optimal
results:
•
•
•
below 225 C (SnPb process) or below 245 C (Pb-free process)
below 240 C (SnPb process) or below 260 C (Pb-free process) for packages with
a thickness < 2.5 mm and a volume < 350 mm
Use a double-wave soldering method comprising a turbulent wave with high
upward pressure followed by a smooth laminar wave.
– for all BGA, HTSSON..T and SSOP..T packages
– for packages with a thickness
– for packages with a thickness < 2.5 mm and a volume
thick/large packages.
Quad UART with 16-byte FIFO and infrared (IrDA) encoder/decoder
Rev. 05 — 10 May 2004
2.5 mm
3
SC16C554/554D
so called small/thin packages.
© Koninklijke Philips Electronics N.V. 2004. All rights reserved.
350 mm
3
so called
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