LM48100QMH/NOPB National Semiconductor, LM48100QMH/NOPB Datasheet - Page 18

IC AMP AUDIO PWR 1.6W 14ETSSOP

LM48100QMH/NOPB

Manufacturer Part Number
LM48100QMH/NOPB
Description
IC AMP AUDIO PWR 1.6W 14ETSSOP
Manufacturer
National Semiconductor
Series
Boomer®, PowerWise®r
Type
Class ABr
Datasheet

Specifications of LM48100QMH/NOPB

Output Type
1-Channel (Mono)
Max Output Power X Channels @ Load
1.6W x 1 @ 8 Ohm
Voltage - Supply
3 V ~ 5.5 V
Features
Depop, I²C, Input Multiplexer, Short-Circuit and Thermal Protection, Shutdown, Volume Control
Mounting Type
Surface Mount
Package / Case
14-TSSOP Exposed Pad, 14-eTSSOP 14-HTSSOP
Amplifier Class
AB
No. Of Channels
1
Output Power
1.3W
Supply Voltage Range
3V To 5.5V
Load Impedance
8ohm
Operating Temperature Range
-40°C To +105°C
Amplifier Case Style
TSSOP
Rohs Compliant
Yes
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Other names
LM48100QMH
www.national.com
PCB Layout Guidelines
Minimize trace impedance of the power, ground and all output
traces for optimum performance. Voltage loss due to trace
resistance between the LM48100Q and the load results in
decreased output power and efficiency. Trace resistance be-
tween the power supply and ground has the same effect as a
poorly regulated supply, increased ripple and reduced peak
output power. Use wide traces for power supply inputs and
amplifier outputs to minimize losses due to trace resistance,
as well as route heat away from the device. Proper grounding
improves audio performance, minimizes crosstalk between
channels and prevents digital noise from interfering with the
audio signal. Use of power and ground planes is recommend-
ed.
Place all digital components and route digital signal traces as
far as possible from analog components and traces. Do not
LM48100QTL Demoboard Bill of Materials
LM48100QMH
Designator
JU2–JU12
C3, C5
C6, C7
R1, R2
JU1
C1
C2
C4
R3
J2
Quantity
U1
11
1
1
2
1
2
2
1
1
1
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16-Pin Boardmount Socket 3M 8516-4500JL
3-Pin Header
2 Pin Header
LM48100QMH (14-Pin TSSOP-EP)
18
run digital and analog traces in parallel on the same PCB lay-
er. If digital and analog signal lines must cross either over or
under each other, ensure that they cross in a perpendicular
fashion.
Exposed Dap Mounting
Considerations
The LM48100Q TSSOP-EP package features an exposed
die-attach (thermal) pad on its backside. The exposed pad
provides a direct heat conduction path from the die to the
PCB, reducing the thermal resistance of the package. Con-
nect the exposed pad to GND with a large pad and via to a
large GND plane on the bottom of the PCB for best heat dis-
tribution.
Description

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