AD9500BQ Analog Devices, AD9500BQ Datasheet - Page 5

• Manufacturer Part Number: AD9500BQ
• Description: 7V; 30mA; digitaly programmable delay generator. For ATE, pulse deskewing, arbitary waveform generators
• Manufacturer: Analog Devices

AD9500
Figure 1. System Timing Diagram
DIE LAYOUT
MECHANICAL INFORMATION
Die Dimensions . . . . . . . . . . . . . . . 104
103
18 (max) mils
Pad Dimensions . . . . . . . . . . . . . . . . . . . . . . . 4
4 (min) mils
Metalization . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Aluminum
Backing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . None
Substrate Potential . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .–V
S
Passivation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Oxynitride
Die Attach . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .Gold Eutectic
Bond Wire . . . . . . . . 1.25 mil, Aluminum; Ultrasonic Bonding
or 1 mil, Gold; Gold Ball Bonding
REV. D
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