TDA8945S/N1,112 NXP Semiconductors, TDA8945S/N1,112 Datasheet

IC AMP AUDIO PWR 15W MONO 9SIL

TDA8945S/N1,112

Manufacturer Part Number
TDA8945S/N1,112
Description
IC AMP AUDIO PWR 15W MONO 9SIL
Manufacturer
NXP Semiconductors
Type
Class ABr
Datasheet

Specifications of TDA8945S/N1,112

Output Type
1-Channel (Mono)
Package / Case
9-SIL (Straight Leads)
Max Output Power X Channels @ Load
15W x 1 @ 8 Ohm
Voltage - Supply
6 V ~ 25 V
Features
Depop, Mute, Short-Circuit and Thermal Protection, Standby
Mounting Type
Through Hole
Product
Class-AB
Output Power
15 W
Available Set Gain
32 dB
Thd Plus Noise
0.03 %
Operating Supply Voltage
18 V
Maximum Power Dissipation
14000 mW
Maximum Operating Temperature
+ 70 C
Mounting Style
Through Hole
Audio Load Resistance
8 Ohms
Input Signal Type
Differential
Minimum Operating Temperature
- 40 C
Output Signal Type
Differential
Supply Type
Single
Supply Voltage (max)
25 V
Supply Voltage (min)
6 V
Operational Class
Class-AB
Audio Amplifier Output Configuration
1-Channel Mono
Output Power (typ)
15x1@8OhmW
Audio Amplifier Function
Speaker
Total Harmonic Distortion
0.03@8Ohm@1W%
Single Supply Voltage (typ)
18V
Dual Supply Voltage (typ)
Not RequiredV
Power Supply Requirement
Single
Power Dissipation
14W
Rail/rail I/o Type
No
Single Supply Voltage (min)
6V
Single Supply Voltage (max)
25V
Dual Supply Voltage (min)
Not RequiredV
Dual Supply Voltage (max)
Not RequiredV
Operating Temp Range
-40C to 70C
Operating Temperature Classification
Commercial
Mounting
Through Hole
Pin Count
9
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Lead Free Status / RoHS Status
Lead free / RoHS Compliant, Lead free / RoHS Compliant
Other names
568-3509-5
935262856112
TDA8945SU

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
TDA8945S/N1,112
Manufacturer:
ICSI
Quantity:
4 379
1. General description
2. Features
3. Applications
4. Quick reference data
c
c
The TDA8945S is a single-channel audio power amplifier with an output power of
15 W at an 8
(BTL) amplifier with an all-NPN output stage and standby/mute logic. The TDA8945S
comes in a 9-lead single in-line (SIL) power package. The TDA8945S is
printed-circuit board (PCB) compatible with all other types in the TDA894x family.
One PCB footprint accommodates both the mono and the stereo products.
Table 1:
Symbol Parameter
V
I
I
q
stb
CC
TDA8945S
15 W mono Bridge Tied Load (BTL) audio amplifier
Rev. 02 — 7 April 2000
Few external components
Fixed gain
Standby and mute mode
No on/off switching plops
Low standby current
High supply voltage ripple rejection
Outputs short-circuit protected to ground, supply and across the load
Thermally protected
Printed-circuit board compatible.
Mains fed applications (e.g. TV sound)
PC audio
Portable audio.
supply voltage
quiescent supply current
standby supply current
Quick reference data
load and an 18 V supply. The circuit contains a Bridge Tied Load
Conditions
V
CC
= 18 V; R
L
=
Min
6
-
-
Product specification
Typ
18
18
-
Max
25
28
10
Unit
V
mA
A

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TDA8945S/N1,112 Summary of contents

Page 1

TDA8945S 15 W mono Bridge Tied Load (BTL) audio amplifier Rev. 02 — 7 April 2000 1. General description The TDA8945S is a single-channel audio power amplifier with an output power (BTL) amplifier with ...

Page 2

Philips Semiconductors Table 1: Symbol Parameter P o THD G v SVRR 5. Ordering information Table 2: Type number Package TDA8945S 6. Block diagram idth Fig 1. Block diagram. 9397 750 06866 Product specification Quick reference data …continued Conditions output ...

Page 3

Philips Semiconductors 7. Pinning information 7.1 Pinning Fig 2. Pin configuration. 7.2 Pin description Table 3: Symbol OUT V CC OUT+ IN+ IN SVR MODE GND n.c. 8. Functional description The TDA8945S is a mono BTL audio power amplifier capable ...

Page 4

Philips Semiconductors 8.1 Input configuration The TDA8945S inputs can be driven symmetrical (floating) as well as asymmetrical. In the asymmetrical mode one input pin is connected via a capacitor to the signal ground which should be as close as possible ...

Page 5

Philips Semiconductors 8.2.2 Headroom Typical CD music requires at least 12 dB (factor 15.85) dynamic headroom – compared to the average power output – for transferring the loudest parts without distortion Average Listening Level (ALL) – music power ...

Page 6

Philips Semiconductors 8.4 Supply Voltage Ripple Rejection (SVRR) The SVRR is measured with an electrolytic capacitor pin SVR at a bandwidth kHz. of the frequency. A larger capacitor value on the ...

Page 7

Philips Semiconductors 11. Static characteristics Table 7: Static characteristics amb L Symbol Parameter V supply voltage CC I quiescent supply current q I standby supply current ...

Page 8

Philips Semiconductors 12. Dynamic characteristics Table 8: Dynamic characteristics kHz amb L Symbol Parameter P output power o THD total harmonic distortion G ...

Page 9

Philips Semiconductors handbook, halfpage Fig 6. Total harmonic distortion as function of output power. 10 handbook, full pagewidth THD (%) bandpass filter applied. Fig 7. Total harmonic distortion as function of ...

Page 10

Philips Semiconductors 20 handbook, halfpage THD = 10%. Fig 8. Output power as function of supply voltage. 100 handbook, halfpage (%) ...

Page 11

Philips Semiconductors 0 handbook, full pagewidth SVRR (dB 707 mV (RMS); no bandpass filter applied ripple Curve A: inputs short-circuited ...

Page 12

Philips Semiconductors 13. Internal circuitry Table 9: Pin 4 and 5 1 and 9397 750 06866 Product specification Internal circuitry Symbol Equivalent circuit IN+ and IN 5 OUT and OUT+ MODE 7 SVR Rev. 02 — 7 ...

Page 13

Philips Semiconductors 14. Application information handbook, full pagewidth 220 Symmetrical C i input 220 nF 220 Asymmetrical C i input 220 nF signal V CC GND MICROCONTROLLER MODE ...

Page 14

Philips Semiconductors idth Fig 14. Printed-circuit board layout (single-sided); components view. 14.1.2 Power supply decoupling Proper supply bypassing is critical for low-noise performance and high supply voltage ripple rejection. The respective capacitor locations should be as close as possible to ...

Page 15

Philips Semiconductors 14.2 Thermal behaviour and heatsink calculation The measured maximum thermal resistance of the IC package, A calculation for the heatsink can be made, with the following parameters: T amb(max j(max) R th(tot) including the heatsink. ...

Page 16

Philips Semiconductors 16. Package outline SIL9P: plastic single in-line power package; 9 leads DIMENSIONS (mm are the original dimensions UNIT max. max. 4.6 0.75 mm 2.0 1.1 4.4 ...

Page 17

Philips Semiconductors 17. Soldering 17.1 Introduction to soldering through-hole mount packages This text gives a brief insight to wave, dip and manual soldering. A more in-depth account of soldering ICs can be found in our Data Handbook IC26; Integrated Circuit ...

Page 18

Philips Semiconductors 18. Revision history Table 11: Revision history Rev Date CPCN Description 02 20000407 - Product specification; second version; supersedes initial version TDA8945S- April 1999 (9397 750 04878). Modifications: • Table 1 on page • Ordering options ...

Page 19

Philips Semiconductors 19. Data sheet status Datasheet status Product status Definition Objective specification Development This data sheet contains the design target or goal specifications for product development. Specification may change in any manner without notice. Preliminary specification Qualification This data ...

Page 20

Philips Semiconductors Philips Semiconductors - a worldwide company Argentina: see South America Australia: Tel. +61 2 9704 8141, Fax. +61 2 9704 8139 Austria: Tel. +43 160 101, Fax. +43 160 101 1210 Belarus: Tel. +375 17 220 0733, Fax. ...

Page 21

Philips Semiconductors Contents 1 General description . . . . . . . . . . . . . . . . . . . . . . 1 2 Features . . . . . . . . . ...

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