AT32UC3L016 Atmel Corporation, AT32UC3L016 Datasheet - Page 73
AT32UC3L016
Manufacturer Part Number
AT32UC3L016
Description
Manufacturer
Atmel Corporation
Datasheets
1.AT32UC3A0128.pdf
(377 pages)
2.AT32UC3A0128.pdf
(159 pages)
3.AT32UC3L016.pdf
(843 pages)
4.AT32UC3L016.pdf
(110 pages)
Specifications of AT32UC3L016
Flash (kbytes)
16 Kbytes
Pin Count
48
Max. Operating Frequency
50 MHz
Cpu
32-bit AVR
# Of Touch Channels
17
Hardware Qtouch Acquisition
Yes
Max I/o Pins
36
Ext Interrupts
36
Usb Speed
No
Usb Interface
No
Spi
5
Twi (i2c)
2
Uart
4
Lin
4
Graphic Lcd
No
Video Decoder
No
Camera Interface
No
Adc Channels
8
Adc Resolution (bits)
12
Adc Speed (ksps)
460
Analog Comparators
8
Resistive Touch Screen
No
Temp. Sensor
Yes
Crypto Engine
No
Sram (kbytes)
8
Self Program Memory
YES
Dram Memory
No
Nand Interface
No
Picopower
Yes
Temp. Range (deg C)
-40 to 85
I/o Supply Class
1.62 to 3.6
Operating Voltage (vcc)
1.62 to 3.6
Fpu
No
Mpu / Mmu
Yes / No
Timers
6
Output Compare Channels
18
Input Capture Channels
12
Pwm Channels
35
32khz Rtc
Yes
Calibrated Rc Oscillator
Yes
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Part Number:
AT32UC3L016-AUT
Manufacturer:
ATMEL/爱特梅尔
Quantity:
20 000
Company:
Part Number:
AT32UC3L016-D3HR
Manufacturer:
ATMEL
Quantity:
291
Part Number:
AT32UC3L016-D3HR
Manufacturer:
ATMEL/爱特梅尔
Quantity:
20 000
Company:
Part Number:
AT32UC3L016AUT
Manufacturer:
ATMEL
Quantity:
5 804
8. Mechanical Characteristics
8.1
8.1.1
8.1.2
32099G–06/2011
Thermal Considerations
Thermal Data
Junction Temperature
Table 8-1
Table 8-1.
The average chip-junction temperature, T
where:
From the first equation, the user can derive the estimated lifetime of the chip and decide if a
cooling device is necessary or not. If a cooling device is to be fitted on the chip, the second
equation should be used to compute the resulting average chip-junction temperature T
Symbol
θ
θ
θ
θ
θ
θ
1.
2.
• θ
• θ
• θ
• P
• T
JA
JC
JA
JC
JA
JC
Table
42.
JA
JC
HEAT SINK
A
D
T
T
= ambient temperature (°C).
= device power consumption (W) estimated from data provided in the
= package thermal resistance, Junction-to-ambient (°C/W), provided in
= package thermal resistance, Junction-to-case thermal resistance (°C/W), provided in
J
J
=
=
8-1.
summarizes the thermal resistance data depending on the package.
T
T
A
A
= cooling device thermal resistance (°C/W), provided in the device datasheet.
Parameter
Junction-to-ambient thermal resistance
Junction-to-case thermal resistance
Junction-to-ambient thermal resistance
Junction-to-case thermal resistance
Junction-to-ambient thermal resistance
Junction-to-case thermal resistance
+
Thermal Resistance Data
+
P (
(
P
D
D
×
×
θ (
θ
HEATSINK
JA
)
+
θ
JC
) )
J
, in °C can be obtained from the following:
Condition
Still Air
Still Air
Still Air
AT32UC3L016/32/64
TLLGA48
TLLGA48
Package
TQFP48
TQFP48
QFN48
QFN48
Section 7.5 on page
Table
30.06
63.2
21.8
28.3
TBD
Typ
2.5
8-1.
J
°C/W
°C/W
°C/W
in °C.
Unit
73