SAM9X35 Atmel Corporation, SAM9X35 Datasheet - Page 2

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SAM9X35

Manufacturer Part Number
SAM9X35
Description
Manufacturer
Atmel Corporation
Datasheets

Specifications of SAM9X35

Flash (kbytes)
0 Kbytes
Pin Count
217
Max. Operating Frequency
400 MHz
Cpu
ARM926
Hardware Qtouch Acquisition
No
Max I/o Pins
105
Ext Interrupts
105
Usb Transceiver
3
Usb Speed
Hi-Speed
Usb Interface
Host, Device
Spi
2
Twi (i2c)
3
Uart
7
Can
2
Lin
4
Ssc
1
Ethernet
1
Sd / Emmc
2
Graphic Lcd
Yes
Video Decoder
No
Camera Interface
No
Adc Channels
12
Adc Resolution (bits)
10
Adc Speed (ksps)
440
Resistive Touch Screen
Yes
Temp. Sensor
No
Crypto Engine
No
Sram (kbytes)
32
Self Program Memory
NO
External Bus Interface
1
Dram Memory
DDR/LPDDR, SDRAM/LPSDR
Nand Interface
Yes
Picopower
No
Temp. Range (deg C)
-40 to 85
I/o Supply Class
1.8/3.3
Operating Voltage (vcc)
0.9 to 1.1
Fpu
No
Mpu / Mmu
No/Yes
Timers
6
Output Compare Channels
6
Input Capture Channels
6
Pwm Channels
4
32khz Rtc
Yes
Calibrated Rc Oscillator
No
1. Description
The SAM9X35 is a highly-integrated 400 MHz ARM926 embedded MPU, featuring an extensive
peripheral set and high bandwidth architecture for industrial applications that require refined
user interfaces and high-speed communication.
The SAM9X35 features a graphics LCD controller with 4-layer overlay and 2D acceleration (pic-
ture-in-picture, alpha-blending, scaling, rotation, color conversion), and a 10-bit ADC that
supports 4- or 5-wire resistive touchscreen panels. Networking/connectivity peripherals include
two 2.0A/B compatible Controller Area Network (CAN) interfaces and an IEEE Std 802.3-com-
patible 10/100Mbps Ethernet MAC. Multiple communication interfaces include a soft modem
supporting exclusively the Conexant SmartDAA line driver, HS USB Device and Host, FS USB
Host, two HS SDCard/SDIO/MMC interfaces, USARTs, SPIs, I2S, TWIs and 10-bit ADC.
The 10-layer bus matrix associated with 2 x 8 central DMA channels as well as dedicated DMAs
to support the high-speed connectivity peripherals ensure uninterrupted data transfer with mini-
mum processor overhead.
The External Bus Interface incorporates controllers for 8-bank DDR2/LPDDR, SDRAM/LPS-
DRAM, static memories, and specific circuitry for MLC/SLC NAND Flash with integrated ECC.
The SAM9X35 is available in a 217-ball BGA package with 0.8mm ball pitch.
SAM9X35
2
11055AS–ATARM–27-Jul-11

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