BAS21H NXP Semiconductors, BAS21H Datasheet - Page 7

Single high-voltage switching diode, encapsulated in a SOD123F small and flat leadSurface-Mounted Device (SMD) plastic package

BAS21H

Manufacturer Part Number
BAS21H
Description
Single high-voltage switching diode, encapsulated in a SOD123F small and flat leadSurface-Mounted Device (SMD) plastic package
Manufacturer
NXP Semiconductors
Datasheet

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NXP Semiconductors
11. Soldering
12. Mounting
BAS21H_2
Product data sheet
Fig 7. Reflow soldering footprint SOD123F
Fig 8. FR4 PCB, standard footprint SOD123F
2.1
Reflow soldering is the only recommended soldering method.
Dimensions in mm
PCB thickness = 1.6 mm
1.6
(2 )
1.1
Rev. 02 — 3 November
Dimensions in mm
1.2
4.4
2.9
1.6
4
43.4
1.2
1.2
1.1 1.2
Single high-voltage switching diode
1.2
0.5
006aaa670
40
© NXP B.V. 2006. All rights reserved.
solder lands
solder resist
solder paste
occupied area
BAS21H
7 of 10

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