PESDXU1UT_SER NXP Semiconductors, PESDXU1UT_SER Datasheet - Page 8

Ultra low capacitance ElectroStatic Discharge (ESD) protection diode in a SOT23(TO-236AB) small SMD plastic package designed to protect one high-speed data linefrom the damage caused by ESD and other transients

PESDXU1UT_SER

Manufacturer Part Number
PESDXU1UT_SER
Description
Ultra low capacitance ElectroStatic Discharge (ESD) protection diode in a SOT23(TO-236AB) small SMD plastic package designed to protect one high-speed data linefrom the damage caused by ESD and other transients
Manufacturer
NXP Semiconductors
Datasheet
NXP Semiconductors
PESDXU1UT_SER_2
Product data sheet
Circuit board layout and protection device placement
Circuit board layout is critical for the suppression of ESD, Electrical Fast Transient (EFT)
and surge transients. The following guidelines are recommended:
1. Place the PESDxU1UT as close to the input terminal or connector as possible.
2. The path length between the PESDxU1UT and the protected line should be
3. Keep parallel signal paths to a minimum.
4. Avoid running protected conductors in parallel with unprotected conductors.
5. Minimize all printed-circuit board conductive loops including power and ground loops.
6. Minimize the length of the transient return path to ground.
7. Avoid using shared transient return paths to a common ground point.
8. Ground planes should be used whenever possible. For multilayer printed-circuit
minimized.
boards, use ground vias.
Rev. 02 — 20 August 2009
Ultra low capacitance ESD protection diode in SOT23 package
PESDxU1UT series
© NXP B.V. 2009. All rights reserved.
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