IP4085_4385_4386_4387_CX4 NXP Semiconductors, IP4085_4385_4386_4387_CX4 Datasheet - Page 13

• Manufacturer Part Number: IP4085_4385_4386_4387_CX4
• Manufacturer: NXP Semiconductors

NXP Semiconductors
11. Design and assembly recommendations
IP4085_4385_4386_4387_CX4_1
Product data sheet
11.1 PCB design guidelines
11.2 PCB assembly guidelines for Pb-free soldering
For optimum performance it is recommended to use a Non-Solder Mask PCB Design
(NSMD), also known as a copper-defined design, incorporating laser-drilled micro-vias
connecting the ground pads to a buried ground-plane layer. This results in the lowest
possible ground inductance and provides the best high frequency and ESD performance.
For this case, refer to
Table 6.
Table 7.
Parameter
PCB pad diameter
Micro-via diameter
Solder mask aperture diameter
Copper thickness
Copper finish
PCB material
Parameter
Solder screen aperture diameter
Solder screen thickness
Solder paste: Pb-free
Solder/flux ratio
Solder reflow profile
Fig 22. Pb-free solder reflow profile
The device is capable of withstanding at least three reflows of this profile.
Recommended PCB design parameters
Assembly recommendations
T
reflow(peak)
Table 6
Rev. 01 — 26 March 2009
( C)
250
230
217
T
for the recommended PCB design parameters.
IP4085/4385/4386/4387/CX4
Integrated high-performance ESD-protection diodes
pre-heat
t
1
Value or Specification
200 m
100 m (0.004 inch)
370 m
20 m to 40 m
AuNi
FR4
Value or Specification
330 m
100 m (0.004 inch)
SnAg (3 % to 4 %) Cu (0.5 % to 0.9 %)
50/50
see
t
5
Figure 22
t
2
t
t
3
4
cooling rate
001aai943
t (s)
© NXP B.V. 2009. All rights reserved.
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