LPC1343FHN33 NXP Semiconductors, LPC1343FHN33 Datasheet - Page 3

The LPC1343FHN33 is a ARM Cortex-M3 based microcontroller for embedded applications featuring a high level of integration and low power consumption

LPC1343FHN33

Manufacturer Part Number
LPC1343FHN33
Description
The LPC1343FHN33 is a ARM Cortex-M3 based microcontroller for embedded applications featuring a high level of integration and low power consumption
Manufacturer
NXP Semiconductors
Datasheet

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NXP Semiconductors
3. Applications
4. Ordering information
Table 1.
Table 2.
LPC1311_13_42_43
Product data sheet
Type number
LPC1311FHN33
LPC1311FHN33/01
LPC1313FHN33
Type number
LPC1311FHN33
LPC1311FHN33/01
LPC1313FHN33
LPC1313FHN33/01
LPC1313FBD48
LPC1313FBD48/01
LPC1313FHN33/01
LPC1313FBD48
LPC1313FBD48/01
LPC1342FHN33
LPC1342FBD48
LPC1343FHN33
LPC1343FBD48
Ordering information
Ordering options for LPC1311/13/42/43
4.1 Ordering options
Package
Name
HVQFN33
HVQFN33
HVQFN33
HVQFN33
LQFP48
LQFP48
HVQFN33
LQFP48
HVQFN33
LQFP48
Flash
8 kB
8 kB
32 kB
32 kB
32 kB
32 kB
Unique device serial number for identification.
Available as 48-pin LQFP package and 33-pin HVQFN package.
eMetering
Lighting
Alarm systems
White goods
Total
SRAM
4 kB
4 kB
8 kB
8 kB
8 kB
8 kB
Description
HVQFN33: plastic thermal enhanced very thin quad flat package; no
leads; 33 terminals; body 7  7  0.85 mm
HVQFN33: plastic thermal enhanced very thin quad flat package; no
leads; 33 terminals; body 7  7  0.85 mm
HVQFN33: plastic thermal enhanced very thin quad flat package; no
leads; 33 terminals; body 7  7  0.85 mm
HVQFN33: plastic thermal enhanced very thin quad flat package; no
leads; 33 terminals; body 7  7  0.85 mm
LQFP48: plastic low profile quad flat package; 48 leads; body 7  7 
1.4 mm
LQFP48: plastic low profile quad flat package; 48 leads; body 7  7 
1.4 mm
HVQFN33: plastic thermal enhanced very thin quad flat package; no
leads; 33 terminals; body 7  7  0.85 mm
LQFP48: plastic low profile quad flat package; 48 leads; body 7  7 
1.4 mm
HVQFN33: plastic thermal enhanced very thin quad flat package; no
leads; 33 terminals; body 7  7  0.85 mm
LQFP48: plastic low profile quad flat package; 48 leads; body 7  7 
1.4 mm
All information provided in this document is subject to legal disclaimers.
USB
-
-
-
-
-
-
Rev. 4 — 20 June 2011
Power
profiles
no
yes
no
yes
no
yes
UART
RS-485
1
1
1
1
1
1
I
Fast+
1
1
1
1
1
1
2
C/
32-bit ARM Cortex-M3 microcontroller
LPC1311/13/42/43
SSP ADC
1
1
1
1
1
2
channels
8
8
8
8
8
8
Pins
33
33
33
33
48
48
© NXP B.V. 2011. All rights reserved.
Package
HVQFN33
HVQFN33
HVQFN33
HVQFN33
LQFP48
LQFP48
Version
n/a
n/a
n/a
n/a
SOT313-2
SOT313-2
n/a
SOT313-2
n/a
SOT313-2
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