LPC2101_02_03 NXP Semiconductors, LPC2101_02_03 Datasheet - Page 24

• Manufacturer Part Number: LPC2101_02_03
• Description: The LPC2101/02/03 microcontrollers are based on a 16-bit/32-bit ARM7TDMI-S CPU withreal-time emulation that combines the microcontroller with 8 kB, 16 kB or 32 kB ofembedded high-speed flash memory
• Manufacturer: NXP Semiconductors

NXP Semiconductors
Table 5.
T
LPC2101_02_03_4
Product data sheet
Symbol
I
I
I
I
V
V
V
V
I
Oscillator pins
V
pu
DD(CORE)
BAT
2
LI
amb
C-bus pins
IH
IL
hys
OL
i(XTAL1)
= 40 C to +85 C for commercial applications, unless otherwise specified.
Parameter
pull-up current
core supply current
battery supply
current
HIGH-level input
voltage
LOW-level input
voltage
hysteresis voltage
LOW-level output
voltage
input leakage
current
input voltage on pin
XTAL1
Static characteristics
Conditions
V
V
Active mode;
executed from flash; all peripherals
enabled via PCONP register but not
configured to run; CCLK = 70 MHz
Power-down mode;
Deep power-down mode;
RTC off; SRAM off; T
Active mode; CCLK = 70 MHz;
PCLK = 17.5 MHz;
PCLK enabled to RTCK;
RTC clock = 32 kHz (from RTCX
pins); T
Power-down mode;
RTC clock = 32 kHz
(from RTCX pins); T
Deep power-down mode;
RTC off; SRAM off; T
I
V
V
code
OLS
I
DD(3V3)
I
I
…continued
V
V
V
V
V
V
V
V
= 0 V
= V
= 5 V
DD(1V8)
DD(1V8)
DD(1V8)
i(VBAT)
DD(1V8)
DD(1V8)
DD(1V8)
DD(1V8)
while(1){}
= 3 mA
DD(3V3)
amb
< V
= 3.3 V; V
= 1.8 V; T
= 1.8 V; T
= 1.8 V; T
= 1.8 V; V
= 1.8 V; V
= 1.8 V; V
= 1.8 V; V
= 25 C
I
< 5 V
Rev. 04 — 2 June 2009
[12]
DD(1V8)
amb
amb
amb
amb
i(VBAT)
i(VBAT)
i(VBAT)
i(VBAT)
amb
amb
= 25 C
= 25 C
= 25 C
= 85 C
= 25 C
= 25 C
= 1.8 V
= 3.0 V
= 2.5 V
= 3.0 V
= 3.0 V
[13]
[10]
[15]
Single-chip 16-bit/32-bit microcontrollers
Min
0
-
-
-
-
[14]
-
-
-
-
0.7V
-
-
-
-
-
0
15
DD(3V3)
LPC2101/02/03
Typ
0
41
2.5
35
0.7
10
7
8
8
-
-
0.5V
-
2
10
-
50
[1]
DD(3V3)
© NXP B.V. 2009. All rights reserved.
Max
0
70
25
105
-
15
12
12
-
-
0.3V
-
0.4
4
22
1.8
85
DD(3V3)
24 of 37
Unit
mA
V
V
V
V
V
A
A
A
A
A
A
A
A
A
A
A