LPC2101_02_03 NXP Semiconductors, LPC2101_02_03 Datasheet - Page 30

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LPC2101_02_03

Manufacturer Part Number
LPC2101_02_03
Description
The LPC2101/02/03 microcontrollers are based on a 16-bit/32-bit ARM7TDMI-S CPU withreal-time emulation that combines the microcontroller with 8 kB, 16 kB or 32 kB ofembedded high-speed flash memory
Manufacturer
NXP Semiconductors
Datasheet
NXP Semiconductors
LPC2101_02_03_4
Product data sheet
10.2 XTAL and RTC Printed Circuit Board (PCB) layout guidelines
The crystal should be connected on the PCB as close as possible to the oscillator input
and output pins of the chip. Take care that the load capacitors C
case of third overtone crystal usage, have a common ground plane. The external
components must also be connected to the ground plain. Loops must be made as small
as possible, in order to keep the noise coupled in via the PCB as small as possible. Also
parasitics should stay as small as possible. Values of C
smaller accordingly to the increase in parasitics of the PCB layout.
Rev. 04 — 2 June 2009
Single-chip 16-bit/32-bit microcontrollers
x1
and C
LPC2101/02/03
x2
x1
should be chosen
and C
© NXP B.V. 2009. All rights reserved.
x2
, and C
x3
30 of 37
in

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