BSS84AKM NXP Semiconductors, BSS84AKM Datasheet - Page 12
![P-channel enhancement mode Field-Effect Transistor (FET) in a leadless ultra small SOT883 (SC-101) Surface-Mounted Device (SMD) plastic package using Trench MOSFET technology](/photos/41/52/415244/sot883_3d_sml.gif)
BSS84AKM
Manufacturer Part Number
BSS84AKM
Description
P-channel enhancement mode Field-Effect Transistor (FET) in a leadless ultra small SOT883 (SC-101) Surface-Mounted Device (SMD) plastic package using Trench MOSFET technology
Manufacturer
NXP Semiconductors
Datasheet
1.BSS84AKM.pdf
(16 pages)
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NXP Semiconductors
10. Soldering
BSS84AKM
Product data sheet
Fig 19. Reflow soldering footprint for SOT883 (SOT883)
0.9
0.25
(2×)
(2×)
(2×)
0.3
0.4
1.3
0.7
All information provided in this document is subject to legal disclaimers.
0.3
0.4
Rev. 1 — 23 May 2011
0.6
R0.05 (12×)
0.7
50 V, 230 mA P-channel Trench MOSFET
Dimensions in mm
solder lands
solder resist
solder paste
occupied area
BSS84AKM
sot883_fr
© NXP B.V. 2011. All rights reserved.
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