292323-6 TE Connectivity, 292323-6 Datasheet - Page 3

292323-6

Manufacturer Part Number
292323-6
Description
Manufacturer
TE Connectivity
Series
Ar
Datasheets

Specifications of 292323-6

Size
Standard
Gender
Receptacle
Number Of Ports
2
Orientation
Right Angle
Mount Location
Top
Panel Ground Type
Ground Finger
Termination Method
Solder
Tail Length (mm [in])
3.24 [0.128]
Locking Feature
Without
Led
Without
Panel Ground
With
Pcb Mount Retention Type
Kinked Leg(s)
Shell Plating
Bright Tin
Assembly Process Feature
Without Pick and Place Cover
Locating Post(s)
Without
Number Of Positions
4
Contact Termination Type
Through Hole
Contact Plating, Mating Area, Material
Gold or Gold Flash over Palladium Nickel
Contact Plating, Mating Area, Thickness (µm [?in])
0.762 [30]
Housing Color
Black
Industry Standard
USB 2.0
Rohs/elv Compliance
RoHS compliant, ELV compliant
Lead Free Solder Processes
Wave solder capable to 240°C, Wave solder capable to 260°C, Wave solder capable to 265°C
Rohs/elv Compliance History
Always was RoHS compliant
Usb-if Test Id Number (tid)
Not Submitted For Testing
Applies To
Printed Circuit Board
Pcb Thickness, Recommended (mm [in])
1.57 [0.062]
Panel Ground Location
Center
Packaging Method
Tray
ASHL-0005- ES REV A
Para.
3.5.1
3.5.2
3.5.3
3.5.4
3.5.5
3.5.6
3.5.7
3.5.8
3.5
Examination of Product
Termination Resistance
Insulation Resistance
Dielectric Withstanding
voltage
Capacitance
Vibration Random
Physical Shock
Mating Force
Test Requirements and Procedures Summary:
Test Items
AMP Shanghai Ltd
Tyco Electronics
Meets requirements of product drawing
and AMP Spec 114-40054.
1000 MΩ Min.
750 vac at sea level
1 minute hold with no breakdown
or flashover
2 picofarads maximum
No electrical discontinuities greater
than 1 microsecond shall occur.
See Note
No electrical discontinuity greater than
1 microsecond shall occur.
See Note
35 N maximum
R=10 mΩ Max.
Mechanical Requirements
Electrical Requirements
Requirements
PAGE NO
3
108-60034
Visually, dimensionally and
functionally inspected per applicable
inspection plan
AMP Spec 109-6-6
Subject mated contact assembled in
housing to 20 mv maximum open
circuit at 100 ma maximum
See figure 3
AMP Spec 109-28-4
Test between the adjacent contacts
of mating and unmating samples
AMP Spec 109-29-1
Test between the adjacent contacts
of mating and unmating samples
AMP Spec 109-47
Test between the adjacent contacts
of unmating samples at 1KHZ
AMP Spec 109-21-5
Subject mated connectors to 5.35
G’s rms .15 minutes in each of 3
mutually perpendicular planes
See Figure 4
AMP Spec 109-26-1
Except 30 G’s
Subject mated connectors to 30 G’s
half-sine shock pulses of 11
millisecond duration; 3 shocks in
each direction applied along the 3
mutually perpendicular planes, total
18 shocks;
See figure 4
AMP Spec 109-42
Condition A
Measure force necessary to mate
samples at maximum rate of 12.5
mm a minute.
Procedures
REV LOC
O
ES

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