74AUP2G34GM,115 NXP Semiconductors, 74AUP2G34GM,115 Datasheet - Page 13

IC BUFF DL LOW PWR N-INV 6XSON

74AUP2G34GM,115

Manufacturer Part Number
74AUP2G34GM,115
Description
IC BUFF DL LOW PWR N-INV 6XSON
Manufacturer
NXP Semiconductors
Series
74AUPr
Datasheet

Specifications of 74AUP2G34GM,115

Logic Type
Buffer/Line Driver, Non-Inverting
Number Of Elements
2
Number Of Bits Per Element
1
Current - Output High, Low
4mA, 4mA
Voltage - Supply
0.8 V ~ 3.6 V
Operating Temperature
-40°C ~ 125°C
Mounting Type
Surface Mount
Package / Case
6-XSON (Micropak™), SOT-886
Logic Family
AUP
Number Of Channels Per Chip
2
Polarity
Non-Inverting
Supply Voltage (max)
3.6 V
Supply Voltage (min)
0.8 V
Maximum Operating Temperature
+ 125 C
Mounting Style
SMD/SMT
High Level Output Current
- 4 mA
Low Level Output Current
4 mA
Minimum Operating Temperature
- 40 C
Number Of Lines (input / Output)
2 / 2
Propagation Delay Time
16.3 ns at 1.1 V to 1.3 V, 10.3 ns at 1.4 V to 1.6 V, 8.1 ns at 1.65 V to 1.95 V, 6.4 ns at 2.3 V to 2.7 V, 5.6 ns at 3 V to 3.6 V
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Other names
568-2580-2
935279995115
NXP Semiconductors
Fig 11. Package outline SOT891 (XSON6)
74AUP2G34
Product data sheet
XSON6: plastic extremely thin small outline package; no leads; 6 terminals; body 1 x 1 x 0.5 mm
DIMENSIONS (mm are the original dimensions)
Note
1. Can be visible in some manufacturing processes.
UNIT
mm
VERSION
OUTLINE
SOT891
max
0.5
A
max
0.04
A
1
0.20
0.12
e
b
terminal 1
index area
IEC
(1)
L
1.05
0.95
1
D
1.05
0.95
E
0
1
6
JEDEC
0.55
e
All information provided in this document is subject to legal disclaimers.
e
1
REFERENCES
D
0.35
2
5
e
Rev. 3 — 3 September 2010
1
e
1
0.35
0.27
L
b
3
4
JEITA
0.40
0.32
scale
L
1
1
A
1
E
L
A
(1)
2 mm
PROJECTION
EUROPEAN
74AUP2G34
Low-power dual buffer
© NXP B.V. 2010. All rights reserved.
ISSUE DATE
05-04-06
07-05-15
SOT891
13 of 19

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