74AHCT541PW,118 NXP Semiconductors, 74AHCT541PW,118 Datasheet - Page 12

IC BUFF/DVR TRI-ST 8BIT 20TSSOP

74AHCT541PW,118

Manufacturer Part Number
74AHCT541PW,118
Description
IC BUFF/DVR TRI-ST 8BIT 20TSSOP
Manufacturer
NXP Semiconductors
Series
74AHCTr
Datasheet

Specifications of 74AHCT541PW,118

Package / Case
20-TSSOP
Logic Type
Buffer/Line Driver, Non-Inverting
Number Of Elements
1
Number Of Bits Per Element
8
Current - Output High, Low
8mA, 8mA
Voltage - Supply
4.5 V ~ 5.5 V
Operating Temperature
-40°C ~ 125°C
Mounting Type
Surface Mount
Logic Family
AHCT
Number Of Channels Per Chip
8
Polarity
Non-Inverting
Supply Voltage (max)
5.5 V
Supply Voltage (min)
4.5 V
Maximum Operating Temperature
+ 125 C
Mounting Style
SMD/SMT
High Level Output Current
- 8 mA
Low Level Output Current
8 mA
Minimum Operating Temperature
- 40 C
Output Type
3-State
Propagation Delay Time
8.5 ns @ 5 V
Number Of Lines (input / Output)
8 / 8
Logical Function
Buffer/Line Driver
Number Of Elements
1
Number Of Channels
8
Number Of Inputs
8
Number Of Outputs
8
Operating Supply Voltage (typ)
5V
Package Type
TSSOP
Operating Supply Voltage (max)
5.5V
Operating Supply Voltage (min)
4.5V
Quiescent Current
4uA
Technology
CMOS
Pin Count
20
Mounting
Surface Mount
Operating Temp Range
-40C to 125C
Operating Temperature Classification
Automotive
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Lead Free Status / RoHS Status
Lead free / RoHS Compliant, Lead free / RoHS Compliant
Other names
74AHCT541PW-T
74AHCT541PW-T
935261978118

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
74AHCT541PW,118
Manufacturer:
NXP Semiconductors
Quantity:
1 950
Part Number:
74AHCT541PW,118
Manufacturer:
NXP/恩智浦
Quantity:
20 000
NXP Semiconductors
Fig 9. Package outline SOT360-1 (TSSOP20)
74AHC_AHCT541_3
Product data sheet
TSSOP20: plastic thin shrink small outline package; 20 leads; body width 4.4 mm
DIMENSIONS (mm are the original dimensions)
Notes
1. Plastic or metal protrusions of 0.15 mm maximum per side are not included.
2. Plastic interlead protrusions of 0.25 mm maximum per side are not included.
UNIT
mm
VERSION
OUTLINE
SOT360-1
max.
1.1
A
0.15
0.05
A
1
20
1
Z
y
0.95
0.80
A
2
pin 1 index
IEC
0.25
A
3
e
D
0.30
0.19
b
p
MO-153
JEDEC
0.2
0.1
c
b
p
REFERENCES
Rev. 03 — 12 November 2007
D
6.6
6.4
0
(1)
11
10
w
E
4.5
4.3
M
(2)
JEITA
scale
0.65
2.5
e
c
A
H
6.6
6.2
74AHC541; 74AHCT541
2
E
A
1
5 mm
L
1
0.75
0.50
L
H
p
E
E
detail X
0.4
0.3
Q
L
Octal buffer/line driver; 3-state
L
PROJECTION
EUROPEAN
p
0.2
v
Q
A
(A )
0.13
3
w
X
v
0.1
A
© NXP B.V. 2007. All rights reserved.
y
M
ISSUE DATE
A
99-12-27
03-02-19
Z
0.5
0.2
(1)
SOT360-1
8
0
o
o
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