TB62209FG Toshiba, TB62209FG Datasheet - Page 50

• Manufacturer Part Number: TB62209FG
• Manufacturer: Toshiba

Specifications of TB62209FG

• Function: Driver
• Vopmax (vm*): 34V (40V)
• Io (lpeak): 1.5A (1.8A)
• Excitation: 1/16 step
• I/f: CLK input
• Mixed Decay Mode: included
• Package: HSOP36
• Rohs Compatible†: yes

Notes on Contents
1. Block Diagrams
2. Equivalent Circuits
3. Timing Charts
4. Application Examples
5. Test Circuits
IC Usage Considerations
[1]
[2] Do not insert devices incorrectly or in the wrong orientation.
[3] Use an appropriate power supply fuse to ensure that a large current does not continuously flow in
[4] If your design includes an inductive load such as a motor coil, incorporate a protection circuit into
Some of the functional blocks, circuits, or constants in the block diagram may be omitted or simplified
for explanatory purposes.
The equivalent circuit diagrams may be simplified or some parts of them may be omitted for
explanatory purposes.
Timing charts may be simplified for explanatory purposes.
In providing these application examples, Toshiba does not grant the use of any industrial property rights.
Components in the test circuits are used only to obtain and confirm the device characteristics. These
components and circuits are not guaranteed to prevent malfunction or failure from occurring in the
application equipment.
Notes on handling of ICs
The
exceeded, even for a moment. Do not exceed any of these ratings.
Exceeding the rating(s) may cause breakdown, damage or deterioration of the device, which may
result in injury by explosion or combustion.
Make sure that the positive and negative terminals of power supplies are connected properly.
Otherwise, the current or power consumption may exceed the absolute maximum rating, and
exceeding the rating(s) may cause breakdown, damage or deterioration of the device, which may
result in injury by explosion or combustion.
In addition, do not use any device that has had current applied to it while inserted incorrectly or in
the wrong orientation even once.
the event of over current and/or IC failure. The IC will fully break down when used under
conditions that exceed its absolute maximum ratings, when the wiring is routed improperly or when
an abnormal pulse noise occurs from the wiring or load, causing a large current to continuously flow.
Such a breakdown can lead to smoke or ignition. To minimize the effects of a large current flow in
the event of breakdown, fuse capacity, fusing time, insertion circuit location, and other such suitable
settings are required.
the design to prevent device malfunction or breakdown caused by the current resulting from the
inrush current at power ON or the negative current resulting from the back electromotive force at
power OFF. IC breakdown may cause injury, smoke or ignition.
For ICs with built-in protection functions, use a stable power supply with. An unstable power supply may
cause the protection function to not operate, causing IC breakdown. IC breakdown may cause injury, smoke or
ignition
The application examples provided in this data sheet are provided for reference only. Thorough evaluation
and testing should be implemented when designing your application's mass production design.
absolute maximum ratings of a semiconductor device are a set of ratings that must not be
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TB62209FG
2010-07-02