TB62209FG Toshiba, TB62209FG Datasheet - Page 51

• Manufacturer Part Number: TB62209FG
• Manufacturer: Toshiba

Specifications of TB62209FG

• Function: Driver
• Vopmax (vm*): 34V (40V)
• Io (lpeak): 1.5A (1.8A)
• Excitation: 1/16 step
• I/f: CLK input
• Mixed Decay Mode: included
• Package: HSOP36
• Rohs Compatible†: yes

[5]
Points to remember on handling of ICs
(1) Over current Protection Circuit
(2) Thermal Shutdown Circuit
(3) Heat Dissipation Design
(4)
Back-EMF
Carefully select power amp, regulator, or other external components (such as inputs and negative feedback
capacitors) and load components (such as speakers).
If there is a large amount of leakage current such as input or negative feedback capacitors, the IC
output DC voltage will increase. If this output voltage is connected to a speaker with low input
withstand voltage, overcurrent or IC failure can cause smoke or ignition. (The over current can
cause smoke or ignition from the IC itself.) In particular, please pay attention when using a Bridge
Tied Load (BTL) connection type IC that inputs output DC voltage to a speaker directly.
Over current protection circuits (referred to as current limiter circuits) do not necessarily protect
ICs under all circumstances. If the Over current protection circuits operate against the over current,
clear the over current status immediately.
Depending on the method of use and usage conditions, such as exceeding absolute maximum ratings
can cause the over current protection circuit to not operate properly or IC breakdown before
operation. In addition, depending on the method of use and usage conditions, if over current
continues to flow for a long time after operation, the IC may generate heat resulting in breakdown.
Thermal shutdown circuits do not necessarily protect ICs under all circumstances. If the thermal
shutdown circuits operate against the over temperature, clear the heat generation status
immediately.
Depending on the method of use and usage conditions, such as exceeding absolute maximum ratings
can cause the thermal shutdown circuit to not operate properly or IC breakdown before operation.
In using an IC with large current flow such as a power amp, regulator or driver, please design the device so
that heat is appropriately dissipated, not to exceed the specified junction temperature (Tj) at any time or under
any condition. These ICs generate heat even during normal use. An inadequate IC heat dissipation design can
lead to decrease in IC life, deterioration of IC characteristics or IC breakdown. In addition, please design the
device taking into consideration the effect of IC heat dissipation on peripheral components.
When a motor rotates in the reverse direction, stops or slows down abruptly, a current flow back to the motor’s
power supply due to the effect of back-EMF. If the current sink capability of the power supply is small, the
device’s motor power supply and output pins might be exposed to conditions beyond maximum ratings. To avoid
this problem, take the effect of back-EMF into consideration in your system design.
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TB62209FG
2010-07-02