HCPL316J500E AVAGO TECH, HCPL316J500E Datasheet - Page 6

• Manufacturer Part Number: HCPL316J500E
• Manufacturer: AVAGO TECH

Recommended Pb-Free IR Profile
Package Characteristics
All specifications and figures are at the nominal (typical) operating conditions of V
V
Parameter
Input-Output Momentary
Withstand Voltage
Resistance (Input-Output)
Capacitance (Input-Output)
Output IC-to-Pins 9 &10
Thermal Resistance
Input IC-to-Pin 4 Thermal Resistance
Solder Reflow Thermal Profile
6
TEMPERATURE
E
- V
ROOM
EE
= 0 V, and T
NOTES:
THE TIME FROM 25 °C to PEAK TEMPERATURE = 8 MINUTES MAX.
T
T
T
smax
smax
smin
300
200
100
25
T
T
p
L
0
Note: Non-halide flux should be used.
= 200 °C, T
Note: Non-halide flux should be used.
0
150 - 200 °C
217 °C
PREHEATING RATE 3°C + 1°C/–0.5°C/SEC.
REFLOW HEATING RATE 2.5°C ± 0.5°C/SEC.
160°C
150°C
140°C
A
t 25 °C to PEAK
= +25°C.
3 °C/SEC. MAX.
60 to 180 SEC.
smin
PREHEAT
RAMP-UP
= 150 °C
t
50
s
3°C + 1°C/–0.5°C
260 +0/-5 °C
PREHEATING TIME
150°C, 90 + 30 SEC.
TIME
2.5°C ± 0.5°C/SEC.
100
t
TIME (SECONDS)
t
L
p
Symbol
V
R
C
q
q
I-O
O9-10
I4
ISO
I-O
TIME WITHIN 5 °C of ACTUAL
PEAK TEMPERATURE
20-40 SEC.
60 to 150 SEC.
TEMP.
PEAK
245°C
RAMP-DOWN
6 °C/SEC. MAX.
150
Min.
3750
SEC.
SEC.
30
30
50 SEC.
SOLDERING
Typ.
>10
1.3
30
60
200°C
TIME
200
9
PEAK
TEMP.
240°C
Max.
TIGHT
TYPICAL
LOOSE
TEMP.
PEAK
230°C
250
Units
V
Ω
pF
°C/W
rms
CC1
= 5 V, V
Test Conditions
RH < 50%, t = 1 min., 1, 2,
T
V
f = 1 MHz
T
A
A
I-O
= 25°C
= 100°C
= 500 Vdc
CC2
- V
EE
= 30 V,
Note
3
3