74LV241D,112 NXP Semiconductors, 74LV241D,112 Datasheet - Page 2

• Manufacturer Part Number: 74LV241D,112
• Description: IC BUFF/DVR TRI-ST DUAL 20SOIC
• Manufacturer: NXP Semiconductors
• Series: 74LVr

Specifications of 74LV241D,112

• Package / Case: 20-SOIC (7.5mm Width)
• Logic Type: Buffer/Line Driver, Non-Inverting
• Number Of Elements: 2
• Number Of Bits Per Element: 4
• Current - Output High, Low: 8mA, 8mA
• Voltage - Supply: 1 V ~ 3.6 V
• Operating Temperature: -40°C ~ 125°C
• Mounting Type: Surface Mount
• Logic Family: 74LV
• Number Of Channels Per Chip: 8
• Polarity: Non-Inverting
• Supply Voltage (max): 3.6 V
• Supply Voltage (min): 1 V
• Maximum Operating Temperature: + 125 C
• Mounting Style: SMD/SMT
• High Level Output Current: - 8 mA
• Input Bias Current (max): 160 uA
• Low Level Output Current: 8 mA
• Minimum Operating Temperature: - 40 C
• Output Type: 3-State
• Propagation Delay Time: 8 ns
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant, Lead free / RoHS Compliant
• Other names: 568-2937-5; 935186090112

Philips Semiconductors
4. Ordering information
Table 2:
5. Functional diagram
74LV241_3
Product data sheet
Type number
74LV241N
74LV241D
74LV241DB
74LV241PW
Ordering information
Package
Temperature range Name
40 C to +125 C
40 C to +125 C
40 C to +125 C
40 C to +125 C
Fig 1. Functional diagram
DIP20
SO20
SSOP20
TSSOP20
Rev. 03 — 10 October 2005
Description
plastic dual in-line package; 20 leads (300 mil)
plastic small outline package; 20 leads;
body width 7.5 mm
plastic shrink small outline package; 20 leads;
body width 5.3 mm
plastic thin shrink small outline package; 20 leads;
body width 4.4 mm
17
15
13
11
19
2
4
6
8
1
1OE
2OE
1A0
1A1
1A2
1A3
2A0
2A1
2A2
2A3
mna772
1Y0
1Y1
1Y2
1Y3
2Y0
2Y1
2Y2
2Y3
Octal buffer/line driver; 3-state
18
16
14
12
3
5
7
9
© Koninklijke Philips Electronics N.V. 2005. All rights reserved.
74LV241
Version
SOT146-1
SOT163-1
SOT339-1
SOT360-1
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