74AUP1G125GM,115 NXP Semiconductors, 74AUP1G125GM,115 Datasheet - Page 15

• Manufacturer Part Number: 74AUP1G125GM,115
• Description: IC BUFF DVR TRI-ST LOW PWR 6XSON
• Manufacturer: NXP Semiconductors
• Series: 74AUPr

Specifications of 74AUP1G125GM,115

• Logic Type: Buffer/Line Driver, Non-Inverting
• Number Of Elements: 1
• Number Of Bits Per Element: 1
• Current - Output High, Low: 4mA, 4mA
• Voltage - Supply: 0.8 V ~ 3.6 V
• Operating Temperature: -40°C ~ 125°C
• Mounting Type: Surface Mount
• Package / Case: 6-XSON (Micropak™), SOT-886
• Logic Family: AUP
• Number Of Channels Per Chip: 1
• Polarity: Non-Inverting
• Supply Voltage (max): 3.6 V
• Supply Voltage (min): 0.8 V
• Maximum Operating Temperature: + 125 C
• Mounting Style: SMD/SMT
• High Level Output Current: - 4 mA
• Low Level Output Current: 4 mA
• Minimum Operating Temperature: - 40 C
• Number Of Lines (input / Output): 1 / 1
• Output Type: 3-State
• Propagation Delay Time: 19 ns at 1.1 V to 1.3 V, 10.8 ns at 1.4 V to 1.6 V, 8.4 ns at 1.65 V to 1.95 V, 6.3 ns at 2.3 V to 2.7 V, 5.8 ns at 3 V to 3.6 V
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Other names: 568-2554-2; 935279055115

NXP Semiconductors
Fig 12. Package outline SOT833-1 (XSON8)
74AUP2G125
Product data sheet
XSON8: plastic extremely thin small outline package; no leads; 8 terminals; body 1 x 1.95 x 0.5 mm
DIMENSIONS (mm are the original dimensions)
Notes
1. Including plating thickness.
2. Can be visible in some manufacturing processes.
UNIT
mm
SOT833-1
VERSION
OUTLINE
max
A
terminal 1
index area
0.5
e
(1)
8×
(2)
max
0.04
L
A
1
1
0.25
0.17
b
IEC
- - -
1
8
2.0
1.9
D
e
1
1.05
0.95
E
0
2
7
MO-252
JEDEC
0.6
All information provided in this document is subject to legal disclaimers.
e
e
D
REFERENCES
1
0.5
e
Rev. 7 — 21 September 2010
1
3
6
0.35
0.27
L
JEITA
e
- - -
1
0.40
0.32
scale
L
1
1
b
4
5
A
L
1
E
Low-power dual buffer/line driver; 3-state
A
4×
(2)
2 mm
PROJECTION
EUROPEAN
74AUP2G125
© NXP B.V. 2010. All rights reserved.
ISSUE DATE
07-11-14
07-12-07
SOT833-1
15 of 24