MSDC22D-38KX3 Kingmax Semiconductor, MSDC22D-38KX3 Datasheet - Page 7

• Manufacturer Part Number: MSDC22D-38KX3
• Description: DRAM Module, 512 MB PC-2100 DDR SO-DIMM
• Manufacturer: Kingmax Semiconductor

AC TIMMING PARAMETERS AND SPECIFICATIONS
(These AC characteristics were tested on the component)
Kingmax - Memory Module
Row cycle time
Refresh row cycle time
Row active time
/RAS to /CAS delay
Row precharge time
Row active to Row active delay
Write recovery time
Last data in to Read command
Col. address to Col. address delay
Clock cycle time
Clock high level width
Clock low level width
DQS-out access time from CK, /CK
Output data access time from CK, /CK
Data strobe edge to output data edge
Read Preamble
Read Post amble
CK to valid DQS-in
DQS-in setup time
DQS-in hold time
DQS falling edge to CK rising-setup time
DQS falling edge from CK rising-hold time
DQS-in high level width
DQS-in low level width
DQS-in cycle time
Address and Control Input setup time
Address and Control Input hold time
Data-out high impedance time from CK, /CK
Data-out low impedance time from CK, /CK
Input Slew Rate (for input only pins)
Input Slew Rate (for I/O pins)
Output Slew Rate (x8)
Output Slew Rate Matching Ratio (rise to fall)
Parameter
CL = 2.0
CL = 2.5
tWPREH
tDQSCK
tWPRES
Symbol
tSL(IO)
tDQSQ
tDQSH
tCDLR
tDQSL
tSLMR
tRPRE
tDQSS
tSL(O)
tRPST
tRCD
tRRD
tCCD
tSL(I)
tRAS
tDSH
tDSC
tRFC
tDSS
tWR
tCK
tCH
tAC
tRC
tRP
tCL
tHZ
512MB PC-2100 DDR SO-DIMM
tLZ
tIH
tIS
7
tACmin
tACmin
- 400ps
- 400ps
-0.75
-0.75
Min
0.45
0.45
0.75
0.25
0.35
0.35
0.67
7.5
0.9
0.4
0.2
0.2
0.9
0.5
0.5
1.0
65
75
45
20
20
15
10
2
1
1
0
1
1
-
MSDC22D-38KX3
tACmax
tACmax
May 2002 Rev: 1.0
- 400ps
- 400ps
+0.75
+0.75
Max
120K
0.55
0.55
+0.5
1.25
1.1
0.6
1.1
4.5
1.5
13
13
-
-
Unit Note
V/ns
V/ns
V/ns
tCK
tCK
tCK
tCK
tCK
tCK
tCK
tCK
tCK
tCK
tCK
tCK
tCK
tCK
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ps
ps
10
5
5
5
2
6
6
6
7