MC74LVX50DTG ON Semiconductor, MC74LVX50DTG Datasheet - Page 3

• Manufacturer Part Number: MC74LVX50DTG
• Description: IC BUFFER HEX NON-INVERT 14TSSOP
• Manufacturer: ON Semiconductor
• Series: 74LVXr

Specifications of MC74LVX50DTG

• Logic Type: Buffer/Line Driver, Non-Inverting
• Number Of Elements: 6
• Number Of Bits Per Element: 1
• Current - Output High, Low: 4mA, 4mA
• Voltage - Supply: 2 V ~ 3.6 V
• Operating Temperature: -40°C ~ 85°C
• Mounting Type: Surface Mount
• Package / Case: 14-TSSOP
• Circuit Type: Silicon Gate
• Current, Supply: 20 μA
• Function Type: 3-Stages
• Logic Function: Buffer
• Number Of Circuits: Hex
• Package Type: TSSOP-14
• Special Features: Buffered Output
• Temperature, Operating, Range: -40 to +85 °C
• Voltage, Supply: 2 to 3.6 V
• Logic Family: LVX
• Number Of Channels Per Chip: 5
• Polarity: Non-Inverting
• Supply Voltage (max): 3.6 V
• Supply Voltage (min): 2 V
• Maximum Operating Temperature: + 85 C
• Mounting Style: SMD/SMT
• High Level Output Current: - 4 mA
• Low Level Output Current: 4 mA
• Maximum Power Dissipation: 200 mW
• Minimum Operating Temperature: - 40 C
• Number Of Lines (input / Output): 6 / 6
• Propagation Delay Time: 13.6 ns at 2.7 V, 9.7 ns at 3.3 V
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

Maximum ratings are those values beyond which device damage can occur. Maximum ratings applied to the device are individual stress limit
values (not normal operating conditions) and are not valid simultaneously. If these limits are exceeded, device functional operation is not implied,
damage may occur and reliability may be affected.
1. Measured with minimum pad spacing on an FR4 board, using 10 mm−by−1 inch, 2−ounce copper trace with no air flow.
2. Tested to EIA/JESD22−A114−A.
3. Tested to EIA/JESD22−A115−A.
4. Tested to JESD22−C101−A.
5. Tested to EIA/JESD78.
6. Unused inputs may not be left open. All inputs must be tied to a high− or low−logic input voltage level.
NOTE:
RECOMMENDED OPERATING CONDITIONS
MAXIMUM RATINGS
Symbol
Symbol
I
Latchup
Dt/DV
V
T
V
I
MSL
V
V
V
I
OUT
I
q
F
V
OUT
I
STG
T
T
OK
CC
T
ESD
V
CC
IK
CC
JA
IN
A
L
R
O
J
I
The q
and figure below.
DC Supply Voltage
DC Input Voltage
DC Output Voltage
DC Input Diode Current
DC Output Diode Current
DC Output Sink Current
DC Supply Current per Supply Pin
Storage Temperature Range
Lead Temperature, 1 mm from Case for 10 Seconds
Junction Temperature under Bias
Thermal Resistance
Moisture Sensitivity
Flammability Rating
ESD Withstand Voltage
Latchup Performance
Supply Voltage
Input Voltage
Output Voltage
Operating Free−Air Temperature
Input Transition Rise or Fall Rate
JA
of the package is equal to 1/Derating. Higher junction temperatures may affect the expected lifetime of the device per the table
Parameter
Parameter
Above V
http://onsemi.com
CC
MC74LVX50
and Below GND at 85_C (Note 5)
Charged Device Model (Note 4)
Human Body Model (Note 2)
3
Oxygen Index: 30% − 35%
Machine Model (Note 3)
(HIGH or LOW State)
V
CC
= 3.0 V $0.3 V
V
V
O
(Note 6)
I
(Note 1)
TSSOP
< GND
< GND
SOIC
UL 94−V0 @ 0.125 in
*40
Min
*0.5 to V
2.0
0
0
0
*0.5 to )7.0
*0.5 to )7.0
*65 to )150
Level 1
> 2000
)150
$300
Value
> 200
2000
*20
$20
$25
$50
260
125
170
CC
)0.5
)85
Max
V
100
3.6
5.5
CC
_C/W
Unit
Unit
ns/V
mA
mA
mA
mA
mA
_C
_C
_C
_C
V
V
V
V
V
V
V