MC74LVX50DTG ON Semiconductor, MC74LVX50DTG Datasheet - Page 7

IC BUFFER HEX NON-INVERT 14TSSOP

MC74LVX50DTG

Manufacturer Part Number
MC74LVX50DTG
Description
IC BUFFER HEX NON-INVERT 14TSSOP
Manufacturer
ON Semiconductor
Series
74LVXr
Datasheets

Specifications of MC74LVX50DTG

Logic Type
Buffer/Line Driver, Non-Inverting
Number Of Elements
6
Number Of Bits Per Element
1
Current - Output High, Low
4mA, 4mA
Voltage - Supply
2 V ~ 3.6 V
Operating Temperature
-40°C ~ 85°C
Mounting Type
Surface Mount
Package / Case
14-TSSOP
Circuit Type
Silicon Gate
Current, Supply
20 μA
Function Type
3-Stages
Logic Function
Buffer
Number Of Circuits
Hex
Package Type
TSSOP-14
Special Features
Buffered Output
Temperature, Operating, Range
-40 to +85 °C
Voltage, Supply
2 to 3.6 V
Logic Family
LVX
Number Of Channels Per Chip
5
Polarity
Non-Inverting
Supply Voltage (max)
3.6 V
Supply Voltage (min)
2 V
Maximum Operating Temperature
+ 85 C
Mounting Style
SMD/SMT
High Level Output Current
- 4 mA
Low Level Output Current
4 mA
Maximum Power Dissipation
200 mW
Minimum Operating Temperature
- 40 C
Number Of Lines (input / Output)
6 / 6
Propagation Delay Time
13.6 ns at 2.7 V, 9.7 ns at 3.3 V
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
REEL DIMENSIONS
Tape Size
12 mm
16 mm
24 mm
8 mm
8 mm
A
20.2 mm MIN
(0.795”)
T&R Suffix
T1, T2
T3, T4
R2
R2
R2
FULL RADIUS
Figure 8. Reel Winding Direction
Figure 7. Reel Dimensions
DIRECTION OF FEED
http://onsemi.com
1.5 mm MIN
MC74LVX50
(14.173”)
(14.173”)
178 mm
330 mm
330 mm
360 mm
360 mm
A Max
(0.06”)
(13”)
(13”)
BARCODE LABEL
(7”)
7
13.0 mm 0.2 mm
(0.512” 0.008”)
12.4 mm, +2.0 mm, −0.0
16.4 mm, +2.0 mm, −0.0
24.4 mm, +2.0 mm, −0.0
POCKET
(0.646” + 0.078”, −0.00)
(0.961” + 0.078”, −0.00)
8.4 mm, +1.5 mm, −0.0
8.4 mm, +1.5 mm, −0.0
(0.33” + 0.059”, −0.00)
(0.33” + 0.059”, −0.00)
(0.49” + 0.079”, −0.00)
G
50 mm MIN
HOLE
t MAX
(1.969”)
G
14.4 mm
14.4 mm
18.4 mm
22.4 mm
30.4 mm
(0.882”)
(1.197”)
(0.56”)
(0.56”)
(0.72”)
t Max

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