MPC8260 Freescale Semiconductor, Inc, MPC8260 Datasheet - Page 46
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MPC8260
Manufacturer Part Number
MPC8260
Description
Mpc8260 Powerquicc Ii Integrated Communications Processor
Manufacturer
Freescale Semiconductor, Inc
Datasheet
1.MPC8260.pdf
(52 pages)
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Package Description
Symbols used in
5
The following sections provide the package parameters and mechanical dimensions for the MPC826xA.
5.1
Package parameters are provided in
46
OVERBAR
UTM
UTS
UT8
UT16
MII
Package Description
MPC8260A PowerQUICC™ II Integrated Communications Processor Hardware Specifications, Rev. 1.1
Package Parameters
Table 20
Symbol
Package Outline
Interconnects
Pitch
Nominal unmounted package height 1.55 mm
are described in
Parameter
Table
Table 22. Package Parameters
Table 21. Symbol Legend
22. The package type is a 37.5 x 37.5 mm, 480-lead TBGA.
Table
Signals with overbars, such as TA, are active low.
Indicates that a signal is part of the UTOPIA master interface.
Indicates that a signal is part of the UTOPIA slave interface.
Indicates that a signal is part of the 8-bit UTOPIA interface.
Indicates that a signal is part of the 16-bit UTOPIA interface.
Indicates that a signal is part of the media independent interface.
21.
37.5 x 37.5 mm
480 (29 x 29 ball array)
1.27 mm
Value
Meaning
Freescale Semiconductor