BUK127-50DL NXP Semiconductors, BUK127-50DL Datasheet - Page 9

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BUK127-50DL

Manufacturer Part Number
BUK127-50DL
Description
Buk127-50dl Powermos Transistor Logic Level Topfet
Manufacturer
NXP Semiconductors
Datasheet
Philips Semiconductors
MECHANICAL DATA
3 For further information, refer to surface mounting instructions for SOT223 envelope. Epoxy meets UL94 V0 at 1/8". Net Mass: 0.11 g
October 2001
PowerMOS transistor
Logic level TOPFET
Plastic surface mounted package; collector pad for good heat transfer; 4 leads
DIMENSIONS (mm are the original dimensions)
UNIT
mm
VERSION
OUTLINE
SOT223
1.8
1.5
A
0.10
0.01
A
1
1
y
0.80
0.60
b
p
IEC
e
3.1
2.9
1
b
1
Fig.20. SOT223 surface mounting package
b
0.32
0.22
D
e
1
c
2
b
6.7
6.3
D
p
JEDEC
4
3.7
3.3
E
REFERENCES
3
0
4.6
e
w
B
M
2.3
e
SC-73
B
scale
1
EIAJ
9
2
c
H
7.3
6.7
E
4 mm
A
L
1.1
0.7
1
p
0.95
0.85
Q
0.2
v
H
E
E
detail X
0.1
w
3
PROJECTION
.
EUROPEAN
0.1
y
A
L
p
Q
X
ISSUE DATE
97-02-28
99-09-13
v
A
BUK127-50DL
Product specification
M
A
SOT223
Rev 1.011

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