FMA18N25G Fuji Electric holdings CO.,Ltd, FMA18N25G Datasheet - Page 6
FMA18N25G
Manufacturer Part Number
FMA18N25G
Description
N-channel Silicon Power Mosfet
Manufacturer
Fuji Electric holdings CO.,Ltd
Datasheet
1.FMA18N25G.pdf
(19 pages)
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8.Reliability test items
All guaranteed values are under the categories of reliability per non-assembled(only MOSFETs).
Each categories under the guaranteed reliability conform to EIAJ ED4701/100 method104
standards.
Fuji Electric Device Technology Co.,Ltd.
Test
No.
Test items required without fail
Humidification treatment (85±2°C,65±5%RH,168±24hr)
Heat treatment of soldering (Solder Dipping,260±5°C(265°Cmax.),10±1sec,2 times)
1 Terminal
2 Terminal
3 Mounting
4 Vibration
5 Shock
6 Solderability
7 Resistance to
Test
Items
Strength
(Tensile)
Strength
(Bending)
Strength
Soldering Heat
Testing methods and Conditions
Pull force
TO-220,TO-220F : 10N
TO-3P,TO-3PF,TO-247 : 25N
TO-3PL : 45N
T-Pack,K-Pack : 10N
Force maintaining duration :30±5sec
Load force
TO-220,TO-220F : 5N
TO-3P,TO-3PF,TO-247 : 10N
TO-3PL : 15N
T-Pack,K-Pack : 5N
Number of times :2times(90deg./time)
Screwing torque value: (M3)
TO-220,TO-220F : 40±10N ・ cm
TO-3P,TO-3PF,TO-247 : 50±10N ・cm
TO-3PL : 70±10N ・ cm
frequency : 100Hz to 2kHz
Acceleration : 200m/s
Sweeping time : 4min.
48min. for each X,Y&Z directions.
Peak amplitude: 15km/s
Duration time : 0.5ms
3times for each X,Y&Z directions.
Solder temp. : 245 5 C
Immersion time : 5 0.5sec
Each terminal shall be immersed in
the solder bath within 1 to 1.5mm from
the body.
Solder temp. : 260 5 C
Immersion time : 10 1sec
Number of times : 1times
2
2
MS5F06392
Reference
Standard
EIAJ
ED4701/400
method 401
EIAJ
ED4701/400
method 401
EIAJ
ED4701/400
method 402
EIAJ
ED4701/400
method 403
EIAJ
ED4701/400
method 404
EIAJ
ED4701/300
method 302
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Sampling
number
15
15
15
15
15
15
15
6 / 19
Acceptance
number
H04-004-03
(0:1)