BUW13F NXP Semiconductors, BUW13F Datasheet - Page 11
BUW13F
Manufacturer Part Number
BUW13F
Description
Silicon Diffused Power Transistors
Manufacturer
NXP Semiconductors
Datasheet
1.BUW13F.pdf
(16 pages)
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Philips Semiconductors
PACKAGE OUTLINE
1997 Aug 13
Plastic single-ended package; heatsink mounted; 1 mounting hole; 3 leads (in-line)
Silicon diffused power transistors
Note
1. Terminals in this zone are not tinned.
DIMENSIONS (mm are the original dimensions)
UNIT
mm
OUTLINE
VERSION
SOT199
5.2
4.8
A
3.4
3.0
A 1
1.2
1.0
b
D
L
2.1
1.9
b 1
IEC
m
b 1
0.6
0.5
c
1
21.5
20.5
D
e
15.3
14.7
JEDEC
2
E
E 1
e 1
E
P
7.8
6.8
REFERENCES
E 1
b
3
5.45
e
0
10.9
e 1
L 1
scale
EIAJ
q
11
w
5
M
16.5
15.7
L
10 mm
L 1
3.7
3.3
(1)
0.8
0.6
m
3.3
3.1
P
Q
A 1
2.1
1.9
A
Q
BUW13F; BUW13AF
c
PROJECTION
6.2
5.8
EUROPEAN
q
0.4
w
45
Product specification
ISSUE DATE
97-06-27
SOT199