NP160N04TDG Renesas Electronics Corporation., NP160N04TDG Datasheet - Page 7

• Manufacturer Part Number: NP160N04TDG
• Description: Switching N-channel Power Mos Fet
• Manufacturer: Renesas Electronics Corporation.

TAPE INFORMATION
MARKING INFORMATION
RECOMMENDED SOLDERING CONDITIONS
sales representative.
Caution Do not use different soldering methods together (except for partial heating).
The NP160N04TDG should be soldered and mounted under the following recommended conditions.
Infrared reflow
Partial heating
There are two types (-E1, -E2) of taping depending on the direction of the device.
For soldering methods and conditions other than those recommended below, please contact an NEC Electronics
For technical information, see the following website.
Semiconductor Device Mount Manual (http://www.necel.com/pkg/en/mount/index.html)
Soldering Method
Draw-out side
Maximum temperature (Package's surface temperature): 260 ° C or below
Time at maximum temperature: 10 seconds or less
Time of temperature higher than 220 ° C: 60 seconds or less
Preheating time at 160 to 180 ° C: 60 to 120 seconds
Maximum number of reflow processes: 3 times
Maximum chlorine content of rosin flux (percentage mass): 0.2% or less
Maximum temperature (Pin temperature): 350 ° C or below
Time (per side of the device): 3 seconds or less
Maximum chlorine content of rosin flux: 0.2% (wt.) or less
DG
160N04
NEC
Data Sheet D18761EJ2V0DS
Soldering Conditions
Pb-free plating marking
Abbreviation of part number
Lot code
Reel side
NP160N04TDG
Condition Symbol
Recommended
IR60-00-3
P350
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