MC74HCT541ADWG ON Semiconductor, MC74HCT541ADWG Datasheet
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MC74HCT541ADWG
Specifications of MC74HCT541ADWG
MC74HCT541ADWGOS
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MC74HCT541ADWG Summary of contents
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... Inputs Output OE1 OE2 Enables 19 *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. © Semiconductor Components Industries, LLC, 2006 SOIC−20WB DW SUFFIX CASE 751D CASE 948E SOEIAJ− Non−Inverting ...
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... Plastic DIP: – 10 mW/_C from 65_ to 125_C SOIC Package: – 7 mW/_C from 65_ to 125_C For high frequency or heavy load considerations, see Chapter 2 of the ON Semiconductor High−Speed CMOS Data Book (DL129/D). RECOMMENDED OPERATING CONDITIONS Î Î Î Î ...
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... Maximum Input Leakage Current in I Maximum 3−State Leakage Current OZ I Maximum Quiescent Supply Current CC (per Package) DI Additional Quiescent Supply Current CC 1. Information on typical parametric values can be found in Chapter 2 of the ON Semiconductor High−Speed CMOS Data Book (DL129/D). + ΣDI 2. Total Supply Current = CHARACTERISTICS (V = 5.0V Symbol t ...
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... One of Eight INPUT A OE1 OE2 ORDERING INFORMATION Device MC74HCT541AN MC74HCT541ANG MC74HCT541ADW MC74HCT541ADWG MC74HCT541ADWR2 MC74HCT541ADWR2G MC74HCT541ADTR2 MC74HCT541ADTR2G MC74HCT541AFG MC74HCT541AFEL MC74HCT541AFELG †For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D. ...
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SEATING PLANE 0.25 (0.010 20X T 0. 18X A1 MC74HCT541A PACKAGE DIMENSIONS PDIP−20 N SUFFIX CASE ...