MTSF3N03HD ON Semiconductor, MTSF3N03HD Datasheet

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MTSF3N03HD

Manufacturer Part Number
MTSF3N03HD
Description
Hdtmos Power MOSFETs, Micro8, Single N-channel, VDSS 30
Manufacturer
ON Semiconductor
Datasheet

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N–Channel Micro8t
energy in the avalanche and commutation modes and the drain–to–source
diode has a very low reverse recovery time. Micro8 devices are designed
for use in low voltage, high speed switching applications where power
efficiency is important. Typical applications are dc–dc converters, and
power management in portable and battery powered products such as
computers, printers, cellular and cordless phones. They can also be used
for low voltage motor controls in mass storage products such as disk
drives and tape drives. The avalanche energy is specified to eliminate the
guesswork in designs where inductive loads are switched and offer
additional safety margin against unexpected voltage transients.
November, 2000 – Rev. 4
These Power MOSFET devices are capable of withstanding high
PCMCIA cards
Life
Miniature Micro8 Surface Mount Package – Saves Board Space
Extremely Low Profile (<1.1 mm) for thin applications such as
Ultra Low R DS(on) Provides Higher Efficiency and Extends Battery
Logic Level Gate Drive – Can Be Driven by Logic ICs
Diode Is Characterized for Use In Bridge Circuits
Diode Exhibits High Speed, With Soft Recovery
I DSS Specified at Elevated Temperature
Avalanche Energy Specified
Mounting Information for Micro8 Package Provided
Semiconductor Components Industries, LLC, 2000
Preferred Device
1
Preferred devices are recommended choices for future use
and best overall value.
MTSF3N03HDR2
8
Device
Source
Source
Source
ORDERING INFORMATION
Gate
WW
R DS(on) = 40 mW
1
http://onsemi.com
PIN ASSIGNMENT
3 AMPERES
30 VOLTS
CASE 846A
N–Channel
STYLE 1
= Date Code
Package
2
3
4
Micro8
Top View
Micro8
1
Publication Order Number:
8
7
6
5
4000 Tape & Reel
MTSF3N03HD/D
Shipping
MARKING
DIAGRAM
Drain
Drain
Drain
Drain
WW
AA

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MTSF3N03HD Summary of contents

Page 1

... Source 1 2 Source Source 3 Gate 4 Top View ORDERING INFORMATION Device Package MTSF3N03HDR2 Micro8 Preferred devices are recommended choices for future use and best overall value. 1 Publication Order Number: MARKING DIAGRAM Drain 7 Drain Drain 6 Drain 5 Shipping 4000 Tape & Reel MTSF3N03HD/D ...

Page 2

... Single Pulse Drain–to–Source Avalanche Energy – Starting Vdc 5.0 Vdc, Peak 9.0 Apk 5.0 mH Repetitive rating; pulse width limited by maximum junction temperature. Figure 1. 1, Square FR–4 or G–10 PCB MTSF3N03HD Rating Thermal Resistance – Junction to Ambient Total Power Dissipation @ Linear Derating Factor Drain Current – ...

Page 3

... Reverse Recovery Storage Charge 2. Pulse Test: Pulse Width 300 s, Duty Cycle 3. Switching characteristics are independent of operating junction temperature. 4. Reflects typical values. Max limit – Typ SIGMA MTSF3N03HD ( unless otherwise noted) Symbol (Cpk 2.0) (Notes 2. & 4.) V (BR)DSS I DSS ...

Page 4

... TYPICAL ELECTRICAL CHARACTERISTICS Figure 3. On–Region Characteristics Figure 5. On–Resistance versus Gate–to–Source Voltage Figure 7. On–Resistance Variation with Temperature MTSF3N03HD Figure 4. Transfer Characteristics Figure 6. On–Resistance versus Drain Current and Gate Voltage Figure 8. Drain–to–Source Leakage Current versus Voltage http://onsemi ...

Page 5

... RC network. The equations are: t d(on iss /(V GG – V GSP )] t d(off iss GSP ) MTSF3N03HD POWER MOSFET SWITCHING The capacitance (C iss ) is read from the capacitance curve at a voltage corresponding to the off–state condition when calculating t d(on) and is read at a voltage corresponding to the on– ...

Page 6

... The mechanisms at work are finite irremovable circuit parasitic inductances and capacitances acted upon by Figure 12. Diode Forward Voltage versus Current MTSF3N03HD Figure 11. Resistive Switching Time Variation versus Gate Resistance high di/dts. The diode’s negative di/dt during directly controlled by the device clearing the stored charge ...

Page 7

... A power MOSFET designated E–FET can be safely used in switching circuits with unclamped inductive loads. For Figure 14. Maximum Rated Forward Biased Safe Operating Area MTSF3N03HD Figure 13. Reverse Recovery Time ( SAFE OPERATING AREA reliable operation, the stored energy from circuit inductance dissipated in the transistor while in avalanche must be less than the rated limit and must be adjusted for operating conditions differing from those specified ...

Page 8

... MTSF3N03HD TYPICAL ELECTRICAL CHARACTERISTICS Figure 16. Thermal Response Figure 17. Diode Reverse Recovery Waveform http://onsemi.com 8 ...

Page 9

... When using infrared heating with the reflow soldering method, the difference shall be a maximum MTSF3N03HD interface between the board and the package. With the correct pad geometry, the packages will self–align when subjected to a solder reflow process. ...

Page 10

... C 150 C 100 TIME ( MINUTES TOTAL) MTSF3N03HD TYPICAL SOLDER HEATING PROFILE temperature versus time. The line on the graph shows the actual temperature that might be experienced on the surface of a test board at or near a central solder joint. The two profiles are based on a high density and a low density board ...

Page 11

... FEED DIRECTION NOTES: 1. CONFORMS TO EIA–481–1. 2. CONTROLLING DIMENSION: MILLIMETER. 330.0 (13.20) MAX. NOTES: 1. CONFORMS TO EIA–481–1. 2. CONTROLLING DIMENSION: MILLIMETER. 3. INCLUDES FLANGE DISTORTION AT OUTER EDGE. 4. DIMENSION MEASURED AT INNER HUB. MTSF3N03HD TAPE & REEL INFORMATION 2.05 (.080) 1.95 (.077 8.10 (.318) 7.90 (.312) 5.40 (.212) 5.20 (.205) SECTION B– ...

Page 12

... JAPAN: ON Semiconductor, Japan Customer Focus Center 4–32–1 Nishi–Gotanda, Shinagawa–ku, Tokyo, Japan 141–0031 Phone: 81–3–5740–2700 Email: r14525@onsemi.com ON Semiconductor Website: http://onsemi.com For additional information, please contact your local Sales Representative. http://onsemi.com 12 then Dial 866–297–9322 MTSF3N03HD/D ...

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