HY27UH088GDM Hynix Semiconductor, HY27UH088GDM Datasheet - Page 51

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HY27UH088GDM

Manufacturer Part Number
HY27UH088GDM
Description
8G-Bit NAND Flash Memory
Manufacturer
Hynix Semiconductor
Datasheet
MARKING INFORMATION -
Rev 0.5 / Oct. 2005
- Y : Y e a r (e x : 5 = y e a r 2 0 0 5 , 0 6 = y e a r 2 0 0 6 )
- w w : W o rk W e e k (e x : 1 2 = w o rk w e e k 1 2 )
- x x : P ro ce ss C o d e
N o te
- C a p ita l L e tte r
- S m a ll L e tte r
- h y n ix
- K O R
- H Y 2 7 x H x x 8 G 2 M x x x x
M : V e rsio n
x : P a ck a g e T y p e
x : P a ck a g e M a te ria l
x : O p e ra tin g T e m p e ra tu re
x : B a d B lo ck
H : C la ssifica tio n
8 G : D e n sity
x : M o d e
H Y : H Y N IX
2 7 : N A N D F la sh
x : P o w e r S u p p ly
x x : B it O rg a n iza tio n
P a c k a g
T S O P 1
T L G A
/
H
x
Y
x
TSOP, TLGA
2
x
: H y n ix S y m b o l
: O rig in C o u n try
: P a rt N u m b e r
: U (2 .7 V ~ 3 .6 V )
: S in g le L e v e l C e ll+ Q u a d ru p le D ie + L a rg e B lo ck
: 0 8 (x 8 )
: 8 G b it
: 2 (1 n C E & 1 R /n B ; S e q u e n tia l R o w R e a d D isa b le )
: D (D u a l in te rfa ce ; S e q u e n tia l R o w R e a d D isa b le )
: 1 st G e n e ra tio n
: T (4 8 -T S O P 1 ), M (5 2 -T L G A )
: B la n k (N o rm a l), P (L e a d F re e )
: C (0 ℃ ~ 7 0 ℃ ), E (-2 5 ℃ ~ 8 5 ℃ )
: B (In c lu d e d B a d B lo ck ), S (1 ~ 5 B a d B lo ck ),
M (-3 0 ℃ ~ 8 5 ℃ ), I(-4 0 ℃ ~ 8 5 ℃ )
P (A ll G o o d B lo ck )
: F ix e d Ite m
: N o n -fix e d Ite m
7
x
M a rk in g E x a m p le
x
H
x
8Gbit (1Gx8bit) NAND Flash
HY27UH088G(2/D)M Series
Y
x
W
8
W
G
K
Preliminary
O
x
x
M
R
x
51

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