MPC860 Motorola, MPC860 Datasheet - Page 73

• Manufacturer Part Number: MPC860
• Description: Family Hardware Specifications
• Manufacturer: Motorola

14.2 Mechanical Dimensions of the PBGA Package
For more information on the printed circuit board layout of the PBGA package, including
thermal via design and suggested pad layout, please refer to Motorola Application Note,
Plastic Ball Grid Array (order number: AN1231/D), available from your local Motorola
sales office. Figure 14-75 shows the mechanical dimensions of the PBGA package.
MOTOROLA
Figure 14-75. Mechanical Dimensions and Bottom Surface Nomenclature
W
M
V
U
R
P
N
K
H
G
E
D
C
B
A
T
L
J
F
1
E2
2
3
4
5
BOTTOM VIEW
6
7
8
9
10
D1
11
TOP VIEW
12
13
14
D2
D
15
16
17
18
19
MPC860 Family Hardware Specifications
4X
357X
E1
18X
0.15 M C
of the PBGA Package
0.3 M C
E
B
0.2
b
A
e
A B
NOTES:
1. Dimensions and tolerancing per ASME Y14.5M, 1994.
2. Dimensions in millimeters.
3. Dimension b is the maximum solder ball diameter
Mechanical Dimensions of the PBGA Package
measured parallel to datum C.
DIM
A1
A2
A3
D1
D2
E1
E2
A
b
D
E
e
0.35 C
0.2 C
0.25 C
22.40
22.40
MILLIMETERS
MIN
0.50
0.95
0.70
0.60
A3
A2
25.00 BSC
22.86 BSC
25.00 BSC
22.86 BSC
1.27 BSC
---
A1
SIDE VIEW
A
22.60
22.60
MAX
2.05
0.70
1.35
0.90
0.90
C
Case No. 1103-01
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